Zheng, Liqiang; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michael; Ó Mathúna, S. Cian
(IEEE, 2010-12)
In this paper, the embedded capacitance material (ECM) is fabricated between the power and ground layers of the wireless sensor nodes, forming an integrated capacitance to replace the large amount of decoupling capacitors ...