Transfer print techniques for heterogeneous integration of photonic components
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Published Version
Date
2017
Authors
Corbett, Brian M.
Loi, Ruggero
Zhou, Weidong
Liu, Dong
Ma, Zhenqiang
Journal Title
Journal ISSN
Volume Title
Publisher
Pergamon-Elsevier Science Ltd
Published Version
Abstract
The essential functionality of photonic and electronic devices is contained in thin surface layers leaving the substrate often to play primarily a mechanical role. Layer transfer of optimised devices or materials and their heterogeneous integration is thus a very attractive strategy to realise high performance, low-cost circuits for a wide variety of new applications. Additionally, new device configurations can be achieved that could not otherwise be realised. A range of layer transfer methods have been developed over the years including epitaxial lift-off and wafer bonding with substrate removal. Recently, a new technique called transfer printing has been introduced which allows manipulation of small and thin materials along with devices on a massively parallel scale with micron scale placement accuracies to a wide choice of substrates such as silicon, glass, ceramic, metal and polymer. Thus, the co-integration of electronics with photonic devices made from compound semiconductors, silicon, polymer and new 2D materials is now achievable in a practical and scalable method. This is leading to exciting possibilities in microassembly. We review some of the recent developments in layer transfer and particularly the use of the transfer print technology for enabling active photonic devices on rigid and flexible foreign substrates.
Description
Keywords
Epitaxial lift off , Light emitting diodes , High efficiency , Solar cells , Silicon , Nanomembrane , Substrate , Photodetector , Transistors , Performance
Citation
Corbett, B., Loi, R., Zhou, W., Liu, D. and Ma, Z. (2017) 'Transfer print techniques for heterogeneous integration of photonic components', Progress in Quantum Electronics, 52 (17pp). doi: 10.1016/j.pquantelec.2017.01.001