Investigation of the soft-magnetic properties of CoZrTaB laminated cores by dielectric layer tuning

Loading...
Thumbnail Image
Files
Final Manuscript.pdf(759.86 KB)
Accepted Version
Date
2023-09-26
Authors
Wei, Guannan
Das, Rajasree
Lordan, Daniel
Lorenc, Marek
Clark, Barry
Hurley, David P. F.
Hayes, Mike
O'Mathuna, Cian
Sai, Ranajit
McCloskey, Paul
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Research Projects
Organizational Units
Journal Issue
Abstract
Soft magnetic properties of thin films for use as a core material are critical for the realization of future miniaturized electromagnetic devices operating at frequencies of tens or hundreds of megahertz. Laminated stacks consisting of alternate thin layers of magnetic material and dielectric material are widely used to suppress eddy current losses that dominate, especially at a higher frequency of operation. Thus, identifying a suitable dielectric layer, its optimum thickness, and the understanding of its effect on the performance of the laminated core is important. In this letter, six different CoZrTaB (CZTB) laminated cores are reported, featuring a variety of dielectric materials (AlN, SiN, Al 2 O 3 , and oxide CZTB) and/or dielectric thickness (5, 15, and 50 nm). This study shows that stacks with different dielectric materials have a varied residual stress that plays an important role in inducing magnetic anisotropy, thus affecting the permeability. CZTB stacks with oxide CZTB dielectric show the best combination of high permeability, low coercivity, and low losses at high frequency.
Description
Keywords
Soft magnetic materials , Dielectric material , Magnetics on silicon , Soft magnetic laminated stacks , Thin-film technology
Citation
Wei, G., Das, R., Lordan, D., Lorenc, M., Clarke, B., Hurley, D. P., Hayes, M., O'Mathuna, C., Sai, R. and McCloskey, P. (2023) 'Investigation on the soft-magnetic properties of CoZrTaB laminated cores by dielectric layer tuning', IEEE Magnetics Letters, 14, 7100305 (5pp). https://doi.org/10.1109/LMAG.2023.3319289
Link to publisher’s version
Copyright
© 2023, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.