Design and implementation of the embedded capacitance layers for decoupling of wireless sensor nodes

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dc.contributor.authorZheng, Liqiang
dc.contributor.authorMathewson, Alan
dc.contributor.authorO'Flynn, Brendan
dc.contributor.authorHayes, Michael
dc.contributor.authorÓ Mathúna, S. Cian
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2012-01-10T16:03:42Z
dc.date.available2012-01-10T16:03:42Z
dc.date.issued2010-12
dc.date.updated2012-01-10T15:50:26Z
dc.description.abstractIn this paper, the embedded capacitance material (ECM) is fabricated between the power and ground layers of the wireless sensor nodes, forming an integrated capacitance to replace the large amount of decoupling capacitors on the board. The ECM material, whose dielectric constant is 16, has the same size of the wireless sensor nodes of 3cm*3cm, with a thickness of only 14μm. Though the capacitance of a single ECM layer being only around 8nF, there are two reasons the ECM layers can still replace the high frequency decoupling capacitors (100nF in our case) on the board. The first reason is: the parasitic inductance of the ECM layer is much lower than the surface mount capacitors'. A smaller capacitance value of the ECM layer could achieve the same resonant frequency of the surface mount decoupling capacitors. Simulation and measurement fit this assumption well. The second reason is: more than one layer of ECM material are utilized during the design step to get a parallel connection of the several ECM capacitance layers, finally leading to a larger value of the capacitance and smaller value of parasitic. Characterization of the ECM is carried out by the LCR meter. To evaluate the behaviors of the ECM layer, time and frequency domain measurements are performed on the power-bus decoupling of the wireless sensor nodes. Comparison with the measurements of bare PCB board and decoupling capacitors solution are provided to show the improvement of the ECM layer. Measurements show that the implementation of the ECM layer can not only save the space of the surface mount decoupling capacitors, but also provide better power-bus decoupling to the nodes.en
dc.description.sponsorshipScientific Foundation Ireland (ITOBO (398-CRP))en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationZheng, Liqiang;Mathewson, Alan;O'Flynn, Brendan;Hayes, Michael;Ó Mathúna, S. Cian (2010) Design and implementation of the embedded capacitance layers for decoupling of wireless sensor nodes 12th Electronics Packaging Technology Conference (EPTC). 8-10 Dec. 2010, Singapore.en
dc.identifier.doi10.1109/EPTC.2010.5702726
dc.identifier.endpage690en
dc.identifier.isbn978-1-4244-8560-4
dc.identifier.isbn978-1-4244-8561-1
dc.identifier.startpage687en
dc.identifier.urihttps://hdl.handle.net/10468/489
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartof12th Electronics Packaging Technology Conference (EPTC), 2010. 8-10 Dec, 2010, Singapore
dc.rights(c) 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.en
dc.subjectEmbedded capacitance material layersen
dc.subjectCapacitanceen
dc.subjectLCR meteren
dc.subject.lcshElectronic apparatus and appliancesen
dc.subject.lcshPrinted circuitsen
dc.subject.lcshWireless sensor nodesen
dc.subject.lcshSurface mount technologyen
dc.titleDesign and implementation of the embedded capacitance layers for decoupling of wireless sensor nodesen
dc.typeConference itemen
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