Tyndall National Institute is one of Europe's leading research centres, specialising in Information and Communications Technology (ICT) hardware. Tyndall has a critical mass of over 360 researchers, engineers, students and support staff placing a particular emphasis on quality, accomplishment and the delivery to Ireland of value from research. Tyndall’s areas of expertise range from micro-nanolectronics, microsystems, and photonics to theory modeling supported by a central fabrication facility.
We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers.
(Institute of Electrical and Electronics Engineers (IEEE), 2020-01-16) Abrams, Nathan C.; Cheng, Qixiang; Glick, Madeleine; Jezzini, Moises; Morrissey, Padraic; O'Brien, Peter; Bergman, Keren; U.S. Department of Energy; Advanced Research Projects Agency - Energy
Widespread adoption of silicon photonics into datacenters requires that the integration of the driving electronics with the photonics be an essential component of transceiver development. In this article, we describe our silicon photonic transceiver design: a 2.5D integrated multi-chip module (MCM) for 4-channel wavelength division multiplexed (WDM) microdisk modulation targeting 10 Gbps per channel. A silicon interposer is used to provide connectivity between the photonic integrated circuit (PIC) and the commercial transimpedance amplifiers (TIAs). Error free modulation is demonstrated at 10 Gbps with -16 dBm received power for the photonic bare die and at 6 Gbps with -15 dBm received power for the first iteration of the MCM transceiver. In this context, we outline the different integration approaches currently being employed to interface between electronics and photonics - monolithic, 2D, 3D, and 2.5D - and discuss their tradeoffs. Notable demonstrations of the various integration architectures are highlighted. Finally, we address the scalability of the architecture and highlight a subsequent prototype employing custom electronic integrated circuits (EICs).
(Optical Society of America, 2019-01-16) Cheng, Qixiang; Dai, Liang Yuan; Abrams, Nathan C.; Hung, Yu-Han; Morrissey, Padraic E.; Glick, Madeleine; O'Brien, Peter A.; Bergman, Keren; Air Force Research Laboratory; Advanced Research Projects Agency - Energy; Horizon 2020; Rockport Networks Inc.
We report on the first monolithically integrated microring-based optical switch in the switch-and-select architecture. The switch fabric delivers strictly non-blocking connectivity while completely canceling the first-order crosstalk. The 4×4 switching circuit consists of eight silicon microring-based spatial (de-)multiplexers interconnected by a Si/SiN dual-layer crossing-free central shuffle. Analysis of the on-state and off-state power transfer functions reveals the extinction ratios of individual ring resonators exceeding 25 dB, leading to switch crosstalk suppression of up to over 50 dB in the switch-and-select topology. Optical paths are assessed, showing losses as low as 0.1 dB per off-resonance ring and 0.5 dB per on-resonance ring. Photonic switching is actuated with integrated micro-heaters to give an ∼24 GHz passband. The fully packaged device is flip-chip bonded onto a printed circuit board breakout board with a UV-curved fiber array.