Tyndall National Institute - Conference Items
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Item Packaging design challenges of high-density high-speed silicon photonic receiver(2019) Hwang, How Yuan; Morrisey, Padraic; Gazman, Alexander; London, Yanir; Bergman, Keren; O’Brien, Peter; Science Foundation IrelandWe report on the first optically and electrically packaged prototype of the 48-channels silicon photonic single mode receiver device. The receiver device, measuring 11.8 mm x 32 mm, has 48 monolithically integrated Ge p-i-n photodetectors, 144 Al bond pads along three edges and 50 input grating couplers (including alignment shunts) located in the middle. The first receiver package prototype utilised short-length Au wire bonding from device bond pad to high speed board with edge SMP terminations. A 64-channel angle-polished fibre array was coupled permanently, with fibre-to-fibre transmission loss of 8.15 dB recorded through the alignment shunt. The current prototype package was able to conservatively support an aggregated data rate up to 480 Gbps (10 Gbps per photodetector). This paper discusses the design, process and materials integration of the prototype package, as well as the challenges encountered with respect to packaging. Results and analyses of the current prototype are also discussed.Item Development of 808 nm laser-assisted-bonding (LAB) for photonic system-in-package integration(Institute of Electrical and Electronics Engineers (IEEE), 2024-09-23) Shortiss, Kevin; Hwang, How Yuan; Parra-Cetina, Josue; Seyfried, Moritz; O'Brien, Peter; Horizon 2020We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.Item Photonic chiplet integration on optical interposer: Can hybrid bonding realize passive optical coupling?(Institute of Electrical and Electronics Engineers (IEEE), 2024-08-09) Hwang, How Yuan; O’Brien, Peter; Science Foundation IrelandSilicon photonic integrated circuits (Si-PIC) have come a long way since Soref et al. first proposed the use of silicon waveguides in the mid-1980s. However, even after four decades, packaging and integration of silicon photonic systems remain an under-studied area. Most of the packaging activities have been focusing on Fibre-to-PIC coupling, and how to achieve the lowest possible coupling loss. In this paper, we look beyond Fibre-to-PIC coupling, and explore the possibility of PIC-to-PIC integration through a 2.5D optical interposer. We opine that hybrid bonding approach could be a suitable technology for passive PIC-to-PIC integration because it is based on A. gapless (oxide fusion bonding), B. bump-less electrical connection (direct Cu-to-Cu) and C. has a relatively high bonding accuracy (∼ 0.5 µm). Two optical coupling approaches were studied — grating-to-grating coupling, and evanescent coupling based on inverted taper pair. FDTD was used in this activity — first to understand the feasibility of the two coupling approaches and then how potential bonding misalignment can affect PIC-to-PIC coupling losses.Item Microlens-assisted expanded beam technique for coupling of laser source to photonic integrated circuit(Institute of Electrical and Electronics Engineers (IEEE), 2023-11-06) Patil, Chirag M.; Hwang, How Yuan; Pfeiffer, Martin; Noell, Wilfried; Morrissey, Padraic E.; O’Brien, Peter; Horizon 2020Efficient coupling interface is crucial for integrating densely-packed photonic sub-assemblies. This study presents a microlens-assisted expanded-mode technique for coupling light from a laser diode into a photonic-integrated-circuit edge coupler. The results show good coupling with relaxed alignment tolerances, paving the way for efficient free-space optical interconnects in chiplet-based photonic packaging.Item On pollinator monitoring using mmWave micro-Doppler Radar(Institute of Electrical and Electronics Engineers (IEEE), 2024-08-20) Norouzi, Maryam; Barnard, Pieter; Donohue, Ian; Narbudowicz, Adam; Trinity College Dublin; Science Foundation IrelandPollinators serve a crucial role in our global ecosystem by facilitating the reproduction of plants and crops. Despite their vital contribution, factors like urbanization and pesticide use, pose significant threats to the habitats of various pollinator species, such as bees. Therefore, it is increasingly imperative to devise solutions that allow precise and efficient monitoring of their biodiversity. This study presents a low-cost solution based on mmWave Doppler sensor to extract important characteristic wingbeat information of bumblebees through near-field monitoring. By conducting various simulated and real-life experiments, we demonstrate the feasibility of our approach for providing low-cost and effective portable in-field monitoring of pollinators for biodiversity conservation purposes.