Tyndall National Institute - Conference Items

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    Time domain broadband characterization of human cadaver bone (500 -1100nm)
    (Optica Publishing Group, 2024) Kothuri, Suraj Kumar; MacMahon, Danielle; Lanka, Pranav; Andersson-Engels, Stefan; Gautam, Rekha; Sekar, Sanathana Konugolu Venkata; Science Foundation Ireland
    We present optical characterization (500-1100nm) of fresh human bone. We observe the presence of various biomarkers like met-Hb, Hb, lipids, collagen and further discuss the optical properties of cortical bone, trabecular bone, and bone marrow.
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    Graphene field effect transistor on silicon nitride devices for near-infrared wavelength tuning
    (Optica Publishing Group, 2024) Vorobev, A. S.; Mendoza-Castro, J. H.; Iadanza, S.; Jastan, S.; Bianco, G. V.; Bruno, G.; D’Orazio, A.; O’Faolain, Liam; Grande, M.; Horizon 2020
    In this work, we present the Graphene Field Effect Transistor (GFET) on Silicon Nitride waveguides for achieving the wavelength tuning in the Near-Infrared (NIR) range. The obtained Electrolyte-Graphene-Waveguide fabrication and characterization results are demonstrated.
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    Investigation of skin pigmentation influence on the diffuse reflectance signal and oxygen saturation
    (Optica Publishing Group, 2024) Komolibus, Katarzyna; Jayet, Baptiste; Stetson, Paul; Andersson-Engels, Stefan; Science Foundation Ireland
    Using Monte Carlo simulations we show the effect of different melanin concentrations in epidermal layer on the diffuse reflectance signal and the relationship of the double ratio with oxygen saturation levels.
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    Development of 808 nm laser-assisted-bonding (LAB) for photonic system-in-package integration
    (Institute of Electrical and Electronics Engineers (IEEE), 2024-09-23) Shortiss, Kevin; Hwang, How Yuan; Parra-Cetina, Josue; Seyfried, Moritz; O'Brien, Peter; Horizon 2020
    We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.
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    Microlens-assisted expanded beam technique for coupling of laser source to photonic integrated circuit
    (Institute of Electrical and Electronics Engineers (IEEE), 2023-11-06) Patil, Chirag M.; Hwang, How Yuan; Pfeiffer, Martin; Noell, Wilfried; Morrissey, Padraic E.; O’Brien, Peter; Horizon 2020
    Efficient coupling interface is crucial for integrating densely-packed photonic sub-assemblies. This study presents a microlens-assisted expanded-mode technique for coupling light from a laser diode into a photonic-integrated-circuit edge coupler. The results show good coupling with relaxed alignment tolerances, paving the way for efficient free-space optical interconnects in chiplet-based photonic packaging.