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Now showing items 1-6 of 6

Effect of solder volume on joint shape with variable chip-to-board contact pad ratio

Jesudoss, Pio; Mathewson, Alan; Wright, William M. D.; O'Flynn, Brendan; Stam, Frank (IEEE, 2008)
System packaging & integration for a swallowable capsule using a direct access sensor

Jesudoss, Pio; Mathewson, Alan; Wright, William M. D.; McCaffrey, Colm; Ogurtsov, Vladimir I.; Twomey, Karen; Stam, Frank (IEEE, 2009-01)
Development of a highly-miniaturised wireless ISE/pH sensor

Quinlan, Finbarr; Anastasova, Salzitsa; Morris, Virginia N.; Radu, Aleksandar; O'Flynn, Brendan; Mathewson, Alan ([IEEE], 2009-09-24)
A low frequency MEMS energy harvester scavenging energy from magnetic field surrounding an AC current-carrying wire

Olszewski, Oskar Zbigniew; Houlihan, Ruth; Mathewson, Alan; Jackson, Nathan (IOP Publishing, 2016-11)
A silicon-based MEMS vibrating mesh nebulizer for inhaled drug delivery

Olszewski, Oskar Zbigniew; MacLoughlin, Ronan; Blake, Alan; O'Neill, Mike; Mathewson, Alan; Jackson, Nathan (Elsevier Ltd, 2017-01-04)
Silver nanowire array-polymer composite as thermal interface material

Xu, Ju; Munari, Alessio; Dalton, Eric; Mathewson, Alan; Razeeb, Kafil M. (AIP Publishing, 2009)

Now showing items 1-6 of 6