Robust packaging of photonic RF modules using ultrathin adaptive optical interconnect devices

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Date
1997-10-23
Authors
Riza, Nabeel A.
Yuan, ShiFu
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Society of Photo-Optical Instrumentation Engineers (SPIE)
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Abstract
Ultra-thin, electrically programmable, low control power optical devices are proposed as adaptive optical alignment correction devices for future deployable photonic modules for RF signal processing applications. A substantial relative optical/RF gain (i.e., 7.92 dB RF gain) in a free- space PDL that requires a fiber remoted feed in the infrared 1300 nm optical spectrum has been successfully demonstrated.
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Keywords
Adaptive optical interconnect , packaging , Photonic RF module , Phased array antenna , Liquid crystal devices , Adaptive optics , Optical interconnects , Free space optics , Packaging , Connectors , Wavefronts , Fiber optics
Citation
Riza, N. A. and Yuan, S. (1997) 'Robust packaging of Photonic RF Modules using Ultra-Thin Adaptive Optical Interconnect Devices', Proceedings of SPIE, 3160, Optical Technology for Microwave Applications VIII, Optical Science, Engineering and Instrumentation '97 San Diego, CA. USA. doi: 10.1117/12.283941
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© 1997 Society of Photo-Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.