Enhanced thermoelectric properties of electrodeposited Cu-doped Te films

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Date
2020-04-02
Authors
Lal, Swatchith
Razeeb, Kafil M.
Gautam, Devendraprakash
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ACS Publications
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Abstract
Bismuth telluride-based alloys are the best-known thermoelectric materials in the room-temperature regime. Here, we report on the enhanced thermoelectric properties of electrodeposited copper-doped tellurium films as an n-type thermoelectric material for near-room-temperature applications. With the increase of the copper content in the films, we observe an enhancement of the thermoelectric properties. Thereby, we investigate the role of copper in modifying the crystal structure, which leads to the amorphous nature of the films and the corresponding enhancement in the thermoelectric properties. The electrodeposited copper-doped tellurium films exhibit a high Seebeck coefficient of -227 mu V/K, resulting to a power factor of 5.6 mW/mK(2) , which is a promising power factor observed for the electrodeposited thermoelectric materials and can be a favorable n-type thermoelectric material for device applications.
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Thermoelectric material Electrodeposition , Power-factor , Energy harvesting , Cu-doped Te thin films
Citation
Lal, S., Razeeb, K. M. and Gautam, D. (2020) 'Enhanced thermoelectric properties of electrodeposited Cu-doped Te films', ACS Applied Energy Materials, 3(4), pp. 3262-3268. doi: 10.1021/acsaem.9b02153
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© 2020, American Chemical Society. This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Energy Materials after technical editing by the publisher. To access the final edited and published work see https://pubs.acs.org/doi/abs/10.1021/acsaem.9b02153