Silicon photonic 2.5D integrated multi-chip module receiver

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Date
2020-09-10
Authors
Abrams, Nathan C.
Cheng, Qixiang
Glick, Madeleine
Jezzini, Moises
Morrissey, Padraic
O'Brien, Peter
Bergman, Keren
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Institute of Electrical and Electronics Engineers (IEEE)
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Abstract
We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers.
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Keywords
Receivers , Silicon , Photonics , Bandwidth , Optical attenuators , Prototypes , Wavelength division multiplexing
Citation
Abrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O'Brien, P. and Bergman, K. (2020) 'Silicon photonic 2.5D integrated multi-chip module receiver', 2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May, SF1L.3 (2 pp).
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© 2020, the Authors. CLEO 2020 © 2020, OSA. All rights reserved.