Silicon photonic 2.5D integrated multi-chip module receiver

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Silicon photonic 2.5D integrated multi-chip module receiver

Abrams, Nathan C.; Cheng, Qixiang; Glick, Madeleine; Jezzini, Moises; Morrissey, Padraic; O'Brien, Peter; Bergman, Keren
Date: 2020-09-10
Copyright: © 2020, the Authors. CLEO 2020 © 2020, OSA. All rights reserved.
Related: https://www.cleoconference.org/home/
Citation: Abrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O'Brien, P. and Bergman, K. (2020) 'Silicon photonic 2.5D integrated multi-chip module receiver', 2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May, SF1L.3 (2 pp).

Abstract:

We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers.

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