Silicon photonic 2.5D integrated multi-chip module receiver

Abrams, Nathan C.; Cheng, Qixiang; Glick, Madeleine; Jezzini, Moises; Morrissey, Padraic; O'Brien, Peter; Bergman, Keren

Silicon photonic 2.5D integrated multi-chip module receiver

Files

09193351.pdf(598.87 KB)

Published Version

Date

2020-09-10

Authors

Abrams, Nathan C.

Cheng, Qixiang

Glick, Madeleine

Jezzini, Moises

Morrissey, Padraic

O'Brien, Peter

Bergman, Keren

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Abstract

We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers.

Keywords

Receivers , Silicon , Photonics , Bandwidth , Optical attenuators , Prototypes , Wavelength division multiplexing

Citation

Abrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O'Brien, P. and Bergman, K. (2020) 'Silicon photonic 2.5D integrated multi-chip module receiver', 2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May, SF1L.3 (2 pp).