Silicon photonic 2.5D integrated multi-chip module receiver

Abrams, Nathan C.; Cheng, Qixiang; Glick, Madeleine; Jezzini, Moises; Morrissey, Padraic; O'Brien, Peter; Bergman, Keren

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dc.contributor.author	Abrams, Nathan C.
dc.contributor.author	Cheng, Qixiang
dc.contributor.author	Glick, Madeleine
dc.contributor.author	Jezzini, Moises
dc.contributor.author	Morrissey, Padraic
dc.contributor.author	O'Brien, Peter
dc.contributor.author	Bergman, Keren
dc.date.accessioned	2020-10-16T08:40:28Z
dc.date.available	2020-10-16T08:40:28Z
dc.date.issued	2020-09-10
dc.identifier.citation	Abrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O'Brien, P. and Bergman, K. (2020) 'Silicon photonic 2.5D integrated multi-chip module receiver', 2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May, SF1L.3 (2 pp).	en
dc.identifier.startpage	1	en
dc.identifier.endpage	2	en
dc.identifier.isbn	978-1-7281-4418-4
dc.identifier.isbn	978-1-943580-76-7
dc.identifier.issn	2160-8989
dc.identifier.uri	http://hdl.handle.net/10468/10658
dc.description.abstract	We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers.	en
dc.format.mimetype	application/pdf	en
dc.language.iso	en	en
dc.publisher	Institute of Electrical and Electronics Engineers (IEEE)	en
dc.relation.ispartof	2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May
dc.relation.uri	https://www.cleoconference.org/home/
dc.rights	© 2020, the Authors. CLEO 2020 © 2020, OSA. All rights reserved.	en
dc.subject	Receivers	en
dc.subject	Silicon	en
dc.subject	Photonics	en
dc.subject	Bandwidth	en
dc.subject	Optical attenuators	en
dc.subject	Prototypes	en
dc.subject	Wavelength division multiplexing	en
dc.title	Silicon photonic 2.5D integrated multi-chip module receiver	en
dc.type	Conference item	en
dc.internal.authorcontactother	Moises Jezzini, Tyndall National Institute, University College Cork, Cork, Ireland. T: +353-21-490-3000 E: moises.jezzini@tyndall.ie	en
dc.internal.availability	Full text available	en
dc.description.version	Published Version	en
dc.description.status	Peer reviewed	en
dc.internal.conferencelocation	San Jose, CA, USA	en
dc.internal.IRISemailaddress	moises.jezzini@tyndall.ie	en
dc.identifier.articleid	SF1L.3	en