dc.contributor.author |
Abrams, Nathan C. |
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dc.contributor.author |
Cheng, Qixiang |
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dc.contributor.author |
Glick, Madeleine |
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dc.contributor.author |
Jezzini, Moises |
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dc.contributor.author |
Morrissey, Padraic |
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dc.contributor.author |
O'Brien, Peter |
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dc.contributor.author |
Bergman, Keren |
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dc.date.accessioned |
2020-10-16T08:40:28Z |
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dc.date.available |
2020-10-16T08:40:28Z |
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dc.date.issued |
2020-09-10 |
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dc.identifier.citation |
Abrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O'Brien, P. and Bergman, K. (2020) 'Silicon photonic 2.5D integrated multi-chip module receiver', 2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May, SF1L.3 (2 pp). |
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dc.identifier.startpage |
1 |
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dc.identifier.endpage |
2 |
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dc.identifier.isbn |
978-1-7281-4418-4 |
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dc.identifier.isbn |
978-1-943580-76-7 |
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dc.identifier.issn |
2160-8989 |
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dc.identifier.uri |
http://hdl.handle.net/10468/10658 |
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dc.description.abstract |
We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers. |
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dc.format.mimetype |
application/pdf |
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dc.language.iso |
en |
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dc.publisher |
Institute of Electrical and Electronics Engineers (IEEE) |
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dc.relation.ispartof |
2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May |
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dc.relation.uri |
https://www.cleoconference.org/home/ |
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dc.rights |
© 2020, the Authors. CLEO 2020 © 2020, OSA. All rights reserved. |
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dc.subject |
Receivers |
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dc.subject |
Silicon |
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dc.subject |
Photonics |
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dc.subject |
Bandwidth |
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dc.subject |
Optical attenuators |
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dc.subject |
Prototypes |
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dc.subject |
Wavelength division multiplexing |
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dc.title |
Silicon photonic 2.5D integrated multi-chip module receiver |
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dc.type |
Conference item |
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dc.internal.authorcontactother |
Moises Jezzini, Tyndall National Institute, University College Cork, Cork, Ireland. T: +353-21-490-3000 E: moises.jezzini@tyndall.ie |
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dc.internal.availability |
Full text available |
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dc.description.version |
Published Version |
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dc.description.status |
Peer reviewed |
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dc.internal.conferencelocation |
San Jose, CA, USA |
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dc.internal.IRISemailaddress |
moises.jezzini@tyndall.ie |
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dc.identifier.articleid |
SF1L.3 |
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