Silicon photonic 2.5D integrated multi-chip module receiver

Show simple item record Abrams, Nathan C. Cheng, Qixiang Glick, Madeleine Jezzini, Moises Morrissey, Padraic O'Brien, Peter Bergman, Keren 2020-10-16T08:40:28Z 2020-10-16T08:40:28Z 2020-09-10
dc.identifier.citation Abrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O'Brien, P. and Bergman, K. (2020) 'Silicon photonic 2.5D integrated multi-chip module receiver', 2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May, SF1L.3 (2 pp). en
dc.identifier.startpage 1 en
dc.identifier.endpage 2 en
dc.identifier.isbn 978-1-7281-4418-4
dc.identifier.isbn 978-1-943580-76-7
dc.identifier.issn 2160-8989
dc.description.abstract We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers. en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.relation.ispartof 2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May
dc.rights © 2020, the Authors. CLEO 2020 © 2020, OSA. All rights reserved. en
dc.subject Receivers en
dc.subject Silicon en
dc.subject Photonics en
dc.subject Bandwidth en
dc.subject Optical attenuators en
dc.subject Prototypes en
dc.subject Wavelength division multiplexing en
dc.title Silicon photonic 2.5D integrated multi-chip module receiver en
dc.type Conference item en
dc.internal.authorcontactother Moises Jezzini, Tyndall National Institute, University College Cork, Cork, Ireland. T: +353-21-490-3000 E: en
dc.internal.availability Full text available en
dc.description.version Published Version en
dc.description.status Peer reviewed en
dc.internal.conferencelocation San Jose, CA, USA en
dc.internal.IRISemailaddress en
dc.identifier.articleid SF1L.3 en

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