A carbene stabilized precursor for the spatial atomic layer deposition of copper thin films

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dc.contributor.author Boysen, Nils
dc.contributor.author Misimi, Bujamin
dc.contributor.author Muriqi, Arbresha
dc.contributor.author Wree, Jan-Lucas
dc.contributor.author Hasselmann, Tim
dc.contributor.author Rogalla, Detlef
dc.contributor.author Haeger, Tobias
dc.contributor.author Theirich, Detlef
dc.contributor.author Nolan, Michael
dc.contributor.author Riedl, Thomas
dc.contributor.author Devi, Anjana
dc.date.accessioned 2020-11-16T11:59:42Z
dc.date.available 2020-11-16T11:59:42Z
dc.date.issued 2020-10-07
dc.identifier.citation Boysen, N., Misimi, B., Muriqi, A., Wree, J.-L., Hasselmann, T., Rogalla, D., Haeger, T., Theirich, D., Nolan, M., Riedl, T. and Devi, A. (2020) 'A carbene stabilized precursor for the spatial atomic layer deposition of copper thin films', Chemical Communications, 56(89), pp. 13752-13755. doi: 10.1039/d0cc05781a en
dc.identifier.volume 56 en
dc.identifier.issued 89 en
dc.identifier.startpage 13752 en
dc.identifier.endpage 13755 en
dc.identifier.issn 1359-7345
dc.identifier.uri http://hdl.handle.net/10468/10759
dc.identifier.doi 10.1039/d0cc05781a en
dc.description.abstract This paper demonstrates a carbene stabilized precursor [Cu(tBuNHC)(hmds)] with suitable volatility, reactivity and thermal stability, that enables the spatial plasma-enhanced atomic layer deposition (APP-ALD) of copper thin films at atmospheric pressure. The resulting conductive and pure copper layers were thoroughly analysed and a comparison of precursor and process with the previously reported silver analogue [Ag(tBuNHC)(hmds)] revealed interesting similarities and notable differences in precursor chemistry and growth characteristics. This first report of APP-ALD grown copper layers is an important starting point for high throughput, low-cost manufacturing of copper films for nano- and optoelectronic devices. en
dc.description.sponsorship Deutsche Forschungsgemeinschaft (DFG-DE 790-18-1; RI1551/13-1) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Royal Society of Chemistry en
dc.rights © 2020, the Authors. Publication rights licensed to the Royal Society of Chemistry. All rights reserved. en
dc.subject Carbene stabilized precursor [Cu(tBuNHC)-(hmds)] en
dc.subject Spatial plasma-enhanced atomic layer deposition (APP-ALD) en
dc.subject Copper thin films en
dc.subject Atmospheric pressure en
dc.subject Conductive and pure copper layers en
dc.subject Silver analogue [Ag(tBuNHC)(hmds)] en
dc.subject APP-ALD grown copper layers en
dc.title A carbene stabilized precursor for the spatial atomic layer deposition of copper thin films en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Michael Nolan, Tyndall Theory Modelling & Design Centre, University College Cork, Cork, Ireland. +353-21-490-3000 Email: michael.nolan@tyndall.ie en
dc.internal.availability Full text available en
dc.check.info Access to this article is restricted until 12 months after publication by request of the publisher. en
dc.check.date 2021-10-07
dc.date.updated 2020-11-16T11:38:45Z
dc.description.version Accepted Version en
dc.internal.rssid 544123887
dc.internal.pmid 33063069
dc.contributor.funder Deutsche Forschungsgemeinschaft en
dc.contributor.funder Horizon 2020 en
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Chemical Communications en
dc.internal.copyrightchecked Yes
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress michael.nolan@tyndall.ie en
dc.relation.project info:eu-repo/grantAgreement/EC/H2020::MSCA-ITN-ETN/765378/EU/A European Training Network for Functional Hybrid Coatings by Molecular Layer Deposition/HYCOAT en
dc.identifier.eissn 1364-548X

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