dc.contributor.author |
Boysen, Nils |
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dc.contributor.author |
Misimi, Bujamin |
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dc.contributor.author |
Muriqi, Arbresha |
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dc.contributor.author |
Wree, Jan-Lucas |
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dc.contributor.author |
Hasselmann, Tim |
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dc.contributor.author |
Rogalla, Detlef |
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dc.contributor.author |
Haeger, Tobias |
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dc.contributor.author |
Theirich, Detlef |
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dc.contributor.author |
Nolan, Michael |
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dc.contributor.author |
Riedl, Thomas |
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dc.contributor.author |
Devi, Anjana |
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dc.date.accessioned |
2020-11-16T11:59:42Z |
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dc.date.available |
2020-11-16T11:59:42Z |
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dc.date.issued |
2020-10-07 |
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dc.identifier.citation |
Boysen, N., Misimi, B., Muriqi, A., Wree, J.-L., Hasselmann, T., Rogalla, D., Haeger, T., Theirich, D., Nolan, M., Riedl, T. and Devi, A. (2020) 'A carbene stabilized precursor for the spatial atomic layer deposition of copper thin films', Chemical Communications, 56(89), pp. 13752-13755. doi: 10.1039/d0cc05781a |
en |
dc.identifier.volume |
56 |
en |
dc.identifier.issued |
89 |
en |
dc.identifier.startpage |
13752 |
en |
dc.identifier.endpage |
13755 |
en |
dc.identifier.issn |
1359-7345 |
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dc.identifier.uri |
http://hdl.handle.net/10468/10759 |
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dc.identifier.doi |
10.1039/d0cc05781a |
en |
dc.description.abstract |
This paper demonstrates a carbene stabilized precursor [Cu(tBuNHC)(hmds)] with suitable volatility, reactivity and thermal stability, that enables the spatial plasma-enhanced atomic layer deposition (APP-ALD) of copper thin films at atmospheric pressure. The resulting conductive and pure copper layers were thoroughly analysed and a comparison of precursor and process with the previously reported silver analogue [Ag(tBuNHC)(hmds)] revealed interesting similarities and notable differences in precursor chemistry and growth characteristics. This first report of APP-ALD grown copper layers is an important starting point for high throughput, low-cost manufacturing of copper films for nano- and optoelectronic devices. |
en |
dc.description.sponsorship |
Deutsche Forschungsgemeinschaft (DFG-DE 790-18-1; RI1551/13-1) |
en |
dc.format.mimetype |
application/pdf |
en |
dc.language.iso |
en |
en |
dc.publisher |
Royal Society of Chemistry |
en |
dc.rights |
© 2020, the Authors. Publication rights licensed to the Royal Society of Chemistry. All rights reserved. |
en |
dc.subject |
Carbene stabilized precursor [Cu(tBuNHC)-(hmds)] |
en |
dc.subject |
Spatial plasma-enhanced atomic layer deposition (APP-ALD) |
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dc.subject |
Copper thin films |
en |
dc.subject |
Atmospheric pressure |
en |
dc.subject |
Conductive and pure copper layers |
en |
dc.subject |
Silver analogue [Ag(tBuNHC)(hmds)] |
en |
dc.subject |
APP-ALD grown copper layers |
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dc.title |
A carbene stabilized precursor for the spatial atomic layer deposition of copper thin films |
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dc.type |
Article (peer-reviewed) |
en |
dc.internal.authorcontactother |
Michael Nolan, Tyndall Theory Modelling & Design Centre, University College Cork, Cork, Ireland. +353-21-490-3000 Email: michael.nolan@tyndall.ie |
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dc.internal.availability |
Full text available |
en |
dc.check.info |
Access to this article is restricted until 12 months after publication by request of the publisher. |
en |
dc.check.date |
2021-10-07 |
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dc.date.updated |
2020-11-16T11:38:45Z |
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dc.description.version |
Accepted Version |
en |
dc.internal.rssid |
544123887 |
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dc.internal.pmid |
33063069 |
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dc.contributor.funder |
Deutsche Forschungsgemeinschaft
|
en |
dc.contributor.funder |
Horizon 2020
|
en |
dc.contributor.funder |
Science Foundation Ireland
|
en |
dc.description.status |
Peer reviewed |
en |
dc.identifier.journaltitle |
Chemical Communications |
en |
dc.internal.copyrightchecked |
Yes |
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dc.internal.licenseacceptance |
Yes |
en |
dc.internal.IRISemailaddress |
michael.nolan@tyndall.ie |
en |
dc.relation.project |
info:eu-repo/grantAgreement/EC/H2020::MSCA-ITN-ETN/765378/EU/A European Training Network for Functional Hybrid Coatings by Molecular Layer Deposition/HYCOAT
|
en |
dc.identifier.eissn |
1364-548X |
|