Micro-transfer-printing for III-V/Si PICs

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ACPC-2020-T4G.3.pdf(1.31 MB)
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Date
2020-10
Authors
Zhang, Jing
Op de Beeck, Camiel
Haq, Bahawal
Goyvaerts, Jeroen
Cuyvers, Stijn
Kumari, Sulakshna
Muliuk, Grigorij
Hermans, Artur
Gocalińska, Agnieszka M.
Pelucchi, Emanuele
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Optical Society of America
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Abstract
Micro-transfer-printing (µTP) enables the intimate integration of a variety of III-V opto-electronic components on silicon photonic integrated circuits (Si PICs). It allows for the scalable manufacturing of complex III-V/Si PICs at low cost.
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Keywords
Micro-transfer-printing , µTP , III-V opto-electronic components , III-V/Si PIC , Silicon photonic integrated circuits , Si PICs
Citation
Zhang, J., Op de Beeck, C., Haq, B., Goyvaerts, J., Cuyvers, S., Kumari, S., Muliuk, G., Hermans, A., Gocalinska, A., Pelucchi, E., Corbett, B., Trindade, A. J., Bower, C., Van Campenhout, J., Lepage, G., Verheyen, P., Kuyken, B., Van Thourhout, D., Morthier, G., Baets, R. and Roelkens, G. (2020) ‘Micro-transfer-printing for III-V/Si PICs’, Asia Communications and Photonics Conference 2020, Beijing, China, 24-27 October, Paper T4G.3 (3pp). doi: 10.1364/ACPC.2020.T4G.3
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© 2020, the Authors. Published by the Optical Society of America. All rights reserved.