Micro-transfer-printing for III-V/Si PICs
Zhang, Jing; Op de Beeck, Camiel; Haq, Bahawal; Goyvaerts, Jeroen; Cuyvers, Stijn; Kumari, Sulakshna; Muliuk, Grigorij; Hermans, Artur; Gocalinska, Agnieszka; Pelucchi, Emmanuele; Corbett, Brian; Trindade, Antonio Jose; Bower, Chris; Van Campenhout, Joris; Lepage, Guy; Verheyen, Peter; Kuyken, Bart; Van Thourhout, Dries; Morthier, Geert; Baets, Roel; Roelkens, Gunther
Date:
2020-10
Copyright:
© 2020, the Authors. Published by the Optical Society of America. All rights reserved.
Citation:
Zhang, J., Op de Beeck, C., Haq, B., Goyvaerts, J., Cuyvers, S., Kumari, S., Muliuk, G., Hermans, A., Gocalinska, A., Pelucchi, E., Corbett, B., Trindade, A. J., Bower, C., Van Campenhout, J., Lepage, G., Verheyen, P., Kuyken, B., Van Thourhout, D., Morthier, G., Baets, R. and Roelkens, G. (2020) ‘Micro-transfer-printing for III-V/Si PICs’, Asia Communications and Photonics Conference 2020, Beijing, China, 24-27 October, Paper T4G.3 (3pp). doi: 10.1364/ACPC.2020.T4G.3
Abstract:
Micro-transfer-printing (µTP) enables the intimate integration of a variety of III-V opto-electronic components on silicon photonic integrated circuits (Si PICs). It allows for the scalable manufacturing of complex III-V/Si PICs at low cost.
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