Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates

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Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates

Chowdhury, Tamjid; Casey, Declan P.; Rohan, James F.
Date: 2009-06
Copyright: Copyright © 2009 Elsevier B.V. All rights reserved. NOTICE: this is the author’s version of a work that was accepted for publication in Electrochemistry Communications. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Electrochemistry Communications [Volume 11, Issue 6, June 2009, Pages 1203–1206] http://dx.doi.org/10.1016/j.elecom.2009.04.003
Related: http://www.sciencedirect.com/science/article/pii/S1388248109001672
Citation: CHOWDHURY, T., CASEY, D. P. & ROHAN, J. F. 2009. Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates. Electrochemistry Communications, 11, 1203-1206. http://dx.doi.org/10.1016/j.elecom.2009.04.003
Published Version: 10.1016/j.elecom.2009.04.003

Abstract:

Anodised aluminium oxide (AAO) templates have been utilised to investigate Cu deposition from a typical sulphate plating bath. The influence of the common additives poly ethylene glycol (PEG), chloride ion (Cl-) and Bis-(sodium sulphopropyl)-disulphide (SPS) on the deposition process has been analysed. The growth of Cu wires or nanotubes (with tube walls of 40-70 nm) is significantly influenced by the action of the additives. In the presence of either Cl- or SPS solid wire growth is observed, however, when PEG is added with Cl- the growth of ordered Cu nanotubes is observed. SPS added to a bath containing Cl- and PEG restores the growth of wires.

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