Citation:CHOWDHURY, T., CASEY, D. P. & ROHAN, J. F. 2009. Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates. Electrochemistry Communications, 11, 1203-1206. http://dx.doi.org/10.1016/j.elecom.2009.04.003
Anodised aluminium oxide (AAO) templates have been utilised to investigate Cu deposition from a typical sulphate plating bath. The influence of the common additives poly ethylene glycol (PEG), chloride ion (Cl-) and Bis-(sodium sulphopropyl)-disulphide (SPS) on the deposition process has been analysed. The growth of Cu wires or nanotubes (with tube walls of 40-70 nm) is significantly influenced by the action of the additives. In the presence of either Cl- or SPS solid wire growth is observed, however, when PEG is added with Cl- the growth of ordered Cu nanotubes is observed. SPS added to a bath containing Cl- and PEG restores the growth of wires.
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