Cu electrodeposition from methanesulfonate electrolytes for ULSI and MEMS applications

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dc.contributor.author Hasan, Maksudul
dc.contributor.author Rohan, James F.
dc.date.accessioned 2014-01-29T17:30:33Z
dc.date.available 2014-01-29T17:30:33Z
dc.date.copyright 2010
dc.date.issued 2010-05
dc.identifier.citation HASAN, M. & ROHAN, J. F. 2010. Cu Electrodeposition from Methanesulfonate Electrolytes for ULSI and MEMS Applications. Journal of The Electrochemical Society, 157, D278-D282. doi: 10.1149/1.3332729 en
dc.identifier.volume 157 en
dc.identifier.issued 5 en
dc.identifier.startpage 278 en
dc.identifier.endpage 282 en
dc.identifier.issn 0013-4651
dc.identifier.uri http://hdl.handle.net/10468/1346
dc.identifier.doi 10.1149/1.3332729
dc.description.abstract Methanesulfonic acid (MSA) is an alternative to sulfuric acid electrolyte for metal deposition. The electrochemical nucleation and growth of Cu on a glassy carbon electrode in methanesulfonate was compared with sulfate baths. The overpotential for Cu deposition was much smaller in the MSA bath compared to the traditional sulfuric acid bath, and Cu nucleation occurred at a higher rate in the MSA bath. The measured diffusion coefficient value for Cu deposition from the MSA bath was 6.82x10(-6) cm(2)/s. UV-visible spectroscopic results confirmed that the coordination of Cu species was the same in both electrolytes. Cu electrodeposition on Ni sputtered Si substrate from the high efficiency MSA bath was photoresist-compatible with no void formation. One-dimensional Cu nanorods were also deposited through an anodized aluminum oxide template on a Ni evaporated seed layer substrate, showing potential applications as electrical interconnects in ultralarge scale integration (ULSI) and microelectromechanical systems (MEMS). en
dc.description.sponsorship Enterprise Ireland (Technology Development Project CFTD/05/IT/317)) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Electrochemical Society en
dc.relation.uri http://jes.ecsdl.org/content/157/5/D278.abstract
dc.rights © The Electrochemical Society, Inc. 2010. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in HASAN, M. & ROHAN, J. F. 2010. Cu Electrodeposition from Methanesulfonate Electrolytes for ULSI and MEMS Applications. Journal of The Electrochemical Society, 157, D278-D282. en
dc.subject ULSI en
dc.subject Copper en
dc.subject Diffusion en
dc.subject Electrodeposition en
dc.subject Electrolytes en
dc.subject Interconnections en
dc.subject Micromechanical devices en
dc.subject Organic compounds en
dc.subject Photoresists en
dc.subject Interconnect metallization en
dc.title Cu electrodeposition from methanesulfonate electrolytes for ULSI and MEMS applications en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2013-04-26T11:58:05Z
dc.description.version Accepted Version en
dc.internal.rssid 43334345
dc.internal.wokid 000276555300045
dc.contributor.funder Enterprise Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Journal of the Electrochemical Society en
dc.internal.copyrightchecked Yes en
dc.internal.licenseacceptance Yes en


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