• Nitride materials for use in downscaled interconnect technology 

  Nies, Cara-Lena (University College Cork, 2022)

  Copper interconnects will struggle to keep up with the advances in transistor miniaturisation. This creates a significant limiting factor in trying to keep Moore’s Law on track into the 2020’s. At smaller dimensions, Cu ...
• Development of thermoelectric materials and micro-devices for cooling and power generation 

  Lal, Swatchith (University College Cork, 2020-12)

  Thermoelectric materials have been widely used for solid-state cooling (as thermoelectric cooler) and power generation (as thermoelectric generator) applications. Integration of thermoelectric thin-film materials into ...
• Area selective atomic layer deposition of Si-based materials 

  Filatova, Ekaterina A. (University College Cork, 2019)

  Modern electronics are very small and light yet extremely powerful. This is possible due to the constant integration of new techniques and novel materials into the electronics fabrication process. In the current project ...

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