Effect of solder volume on joint shape with variable chip-to-board contact pad ratio

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dc.contributor.author Jesudoss, Pio
dc.contributor.author Mathewson, Alan
dc.contributor.author Wright, William M. D.
dc.contributor.author O'Flynn, Brendan
dc.contributor.author Stam, Frank
dc.date.accessioned 2010-04-12T11:24:54Z
dc.date.available 2010-04-12T11:24:54Z
dc.date.issued 2008
dc.identifier.citation Jesudoss, P., Mathewson, A., Wright, W., O'Flynn, B., Stam, F., 2008. Effect of solder volume on joint shape with variable chip-to-board contact pad ratio. In: IMAPS (International Microelectronics And Packaging Society)-CPMT(Components, Packaging and Manufacturing Technology) 32nd International Microelectronics and Packaging IMAPS-CPMT Poland Conference. Warszawa-Pułtusk, Poland 21-24 September 2008. en
dc.identifier.uri http://hdl.handle.net/10468/150
dc.description.abstract The objective of this paper is to investigate the effect of the pad size ratio between the chip and board end of a solder joint on the shape of that solder joint in combination with the solder volume available. The shape of the solder joint is correlated to its reliability and thus of importance. For low density chip bond pad applications Flip Chip (FC) manufacturing costs can be kept down by using larger size board pads suitable for solder application. By using “Surface Evolver” software package the solder joint shapes associated with different size/shape solder preforms and chip/board pad ratios are predicted. In this case a so called Flip-Chip Over Hole (FCOH) assembly format has been used. Assembly trials involved the deposition of lead-free 99.3Sn0.7Cu solder on the board side, followed by reflow, an underfill process and back die encapsulation. During the assembly work pad off-sets occurred that have been taken into account for the Surface Evolver solder joint shape prediction and accurately matched the real assembly. Overall, good correlation was found between the simulated solder joint shape and the actual fabricated solder joint shapes. Solder preforms were found to exhibit better control over the solder volume. Reflow simulation of commercially available solder preform volumes suggests that for a fixed stand-off height and chip-board pad ratio, the solder volume value and the surface tension determines the shape of the joint. en
dc.description.uri http://imaps2008.imio.pw.edu.pl/ en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IEEE en
dc.relation.ispartof Proceedings XXXII International Microelectronics and Packaging Poland Conference. IEEE Components, Packaging and Manufacturing Technology (CPMT) Society en
dc.rights ©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. en
dc.subject Flip Chip Over Hole en
dc.subject.lcsh Flip chip technology en
dc.subject.lcsh Solder and soldering en
dc.title Effect of solder volume on joint shape with variable chip-to-board contact pad ratio en
dc.type Conference item en
dc.internal.authorcontactother Pio Jesudoss, Microelectronics Applications Integration Group, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: pio.jesudoss@tyndall.ie en
dc.internal.authorcontactother Alan Mathewson, Heterogeneous Systems Integration, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: alan.mathewson@tyndall.ie en
dc.internal.authorcontactother Bill Wright, Department of Electrical and Electronic Engineering, University College Cork, Cork, Ireland. Email: bill.wright@ucc.ie en
dc.internal.authorcontactother Brendan O'Flynn, Microelectronics Applications Integration Group, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: brendan.oflynn@tyndall.ie en
dc.internal.authorcontactother Frank Stam, Microelectronics Applications Integration Group, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: frank.stam@tyndall.ie en
dc.internal.availability Full text available en
dc.description.version Published Version
dc.contributor.funder Enterprise Ireland en
dc.description.status Peer reviewed en
dc.internal.IRISemailaddress pio.jesudoss@tyndall.ie en


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