Miniaturised multi-MEMS sensor development

Show simple item record

dc.contributor.author Hautefeuille, Mathieu
dc.contributor.author O'Mahony, Conor
dc.contributor.author O'Flynn, Brendan
dc.contributor.author Peters, Frank H.
dc.date.accessioned 2010-04-12T12:38:41Z
dc.date.available 2010-04-12T12:38:41Z
dc.date.issued 2008
dc.identifier.citation Hautefeuille, M., O'Mahony, C., O'Flynn, B., Peters, F.H., 2008. Miniaturised multi-MEMS sensor development. In: IMAPS (International Microelectronics And Packaging Society)-CPMT(Components, Packaging and Manufacturing Technology) 32nd International Microelectronics and Packaging IMAPS-CPMT Poland Conference. Warszawa-Pułtusk, Poland 21-24 September 2008. en
dc.identifier.uri http://hdl.handle.net/10468/153
dc.description.abstract Complex systems, from environmental behaviour to electronics reliability, can now be monitored with Wireless Sensor Networks (WSN), where multiple environmental sensors are deployed in remote locations. This ensures aggregation and reading of data, at lower cost and lower power consumption. Because miniaturisation of the sensing system is hampered by the fact that discrete sensors and electronics consume board area, the development of MEMS sensors offers a promising solution. At Tyndall, the fabrication flow of multiple sensors has been made compatible with CMOS circuitry to further reduce size and cost. An ideal platform on which to host these MEMS environmental sensors is the Tyndall modular wireless mote. This paper describes the development and test of the latest sensors incorporating temperature, humidity, corrosion, and gas. It demonstrates their deployment on the Tyndall platform, allowing real-time readings, data aggregation and cross-correlation capabilities. It also presents the design of the next generation sensing platform using the novel 10mm wireless cube developed by Tyndall. en
dc.description.sponsorship Science Foundation Ireland (CSET - Centre for Science, Engineering and Technology) en
dc.description.uri http://imaps2008.imio.pw.edu.pl/ en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IEEE en
dc.relation.ispartof Proceedings XXXII International Microelectronics and Packaging Poland Conference. IEEE Components, Packaging and Manufacturing Technology (CPMT) Society
dc.rights ©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. en
dc.subject Microelectromechanical devices en
dc.subject Environmental management systems en
dc.subject Micromachining en
dc.subject.lcsh Microelectromechanical systems en
dc.subject.lcsh Environmental sampling en
dc.subject.lcsh Wireless sensor networks en
dc.title Miniaturised multi-MEMS sensor development en
dc.type Conference item en
dc.internal.authorcontactother Mathieu Hautefeuille, Centre for Telecommunication Value-Chain Research, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: mathieu.hautefeuille@tyndall.ie en
dc.internal.authorcontactother Conor O'Mahony, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: conor.omahony@tyndall.ie en
dc.internal.authorcontactother Brendan O'Flynn, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: brendan.oflynn@tyndall.ie en
dc.internal.authorcontactother Frank Peters, Physics Department, University College Cork, Ireland. Email: F.Peters@ucc.ie en
dc.internal.availability Full text available en
dc.description.version Accepted Version en
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.internal.IRISemailaddress conor.omahony@tyndall.ie en


Files in this item

This item appears in the following Collection(s)

Show simple item record

This website uses cookies. By using this website, you consent to the use of cookies in accordance with the UCC Privacy and Cookies Statement. For more information about cookies and how you can disable them, visit our Privacy and Cookies statement