Electrical properties of platinum interconnects deposited by electron beam induced deposition of the carbon-free precursor, Pt(PF3)4
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Published Version
Date
2013-03
Authors
O'Regan, Colm
Lee, Angelica
Holmes, Justin D.
Petkov, Nikolay
Trompenaars, Piet
Mulders, Hans
Journal Title
Journal ISSN
Volume Title
Publisher
American Institute of Physics Publishing
Published Version
Abstract
Comprehensive analysis of the electrical properties, structure and composition of Pt interconnects, developed via mask-less, electron beam induced deposition of the carbon-free Pt precursor, Pt(PF3)4, is presented. The results demonstrate significantly improved electrical performance in comparison with that generated from the standard organometallic precursor, (CH3)3Pt(CpCH3). In particular, the Pt interconnects exhibited perfect ohmic behavior and resistivity that can be diminished to 0.24 × 10−3 Ω cm, which is only one order of magnitude higher than bulk Pt, in comparison to 0.2 Ω cm for the standard carbon-containing interconnects. A maximum current density of 1.87 × 107 A cm−2 was achieved for the carbon-free Pt, compared to 9.44 × 105 A cm−2 for the standard Pt precursor. The enhanced electrical properties of the as-deposited materials can be explained by the absence of large amounts of carbon impurities, and their further improvement by postdeposition annealing in N2. In-situ TEM heating experiments confirmed that the annealing step induces sintering of the Pt nanocrystals and improved crystallinity, which contributes to the enhanced electrical performance. Alternative annealing under reducing conditions resulted in improved performance of the standard Pt interconnects, while the carbon-free deposit suffered electrical and structural breakage due to formation of larger Pt islands
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Keywords
Current density , Nanostructured materials , Interconnections , Sintering , Impurities , Platinum , EBIC , Annealing
Citation
O'REGAN, C., LEE, A., HOLMES, J. D., PETKOV, N., TROMPENAARS, P. & MULDERS, H. 2013. Electrical properties of platinum interconnects deposited by electron beam induced deposition of the carbon-free precursor, Pt(PF3)4. Journal of Vacuum Science & Technology B, 31, 021807. doi: 10.1116/1.4794343
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© 2013 American Vacuum Society. All rights reserved.