Development and reliability of a direct access sensor using flip chip on flex technology with anisotropic conductive adhesive

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dc.contributor.advisor Mathewson, Alan en
dc.contributor.advisor Stam, Frank en
dc.contributor.advisor Wright, William M. D. en Jesudoss, Pio 2016-09-13T11:27:38Z 2016-09-13T11:27:38Z 2011 2011
dc.identifier.citation Jesudoss, P. 2011. Development and reliability of a direct access sensor using flip chip on flex technology with anisotropic conductive adhesive. PhD Thesis, University College Cork. en
dc.identifier.endpage 229 en
dc.description.abstract Technological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic sensing capsules are an example of these. In none of the diagnostic sensing capsules, is the sensor’s first level packaging achieved via Flip Chip Over Hole (FCOH) method using Anisotropic Conductive Adhesive (ACA). In a capsule application with direct access sensor (DAS), ACA not only provides the electrical interconnection but simultaneously seals the interconnect area and the underlying electronics. The development showed that the ACA FCOH was a viable option for the DAS interconnection. Adequate adhesive formed a strong joint that withstood a shear stress of 120N/mm2 and a compressive stress of 6N required to secure the final sensor assembly in place before encapsulation. Electrical characterization of the ACA joint in a fluid environment showed that the ACA was saturated with moisture and that the ions in the solution actively contributed to the leakage current, characterized by the varying rate of change of conductance. Long term hygrothermal aging of the ACA joint showed that a thermal strain of 0.004 and a hygroscopic strain of 0.0052 were present and resulted in a fatigue like process. In-vitro tests showed that high temperature and acidity had a deleterious effect of the ACA and its joint. It also showed that the ACA contact joints positioned at around or over 1mm would survive the gastrointestinal (GI) fluids and would be able to provide a reliable contact during the entire 72hr of the GI transit time. A final capsule demonstrator was achieved by successfully integrating the DAS, the battery and the final foldable circuitry into a glycerine capsule. Final capsule soak tests suggested that the silicone encapsulated system could survive the 72hr gut transition. en
dc.description.sponsorship Enterprise Ireland (CFTD /05 / 122); Higher Education Authority (PRTLI-IV project NEMBES) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher University College Cork en
dc.rights © 2011, Pio Jesudoss. en
dc.rights.uri en
dc.subject Flip chip over hole en
dc.subject Anisotropic conductive adhesive en
dc.subject Direct access sensor en
dc.subject Swallowable capsule en
dc.subject Mechanical characterization of anisotropic conductive adhesive en
dc.subject Electrical characterization of anisotropic conductive adhesive en
dc.subject Reliability testing en
dc.subject In-vitro testing en
dc.title Development and reliability of a direct access sensor using flip chip on flex technology with anisotropic conductive adhesive en
dc.type Doctoral thesis en
dc.type.qualificationlevel Doctoral en
dc.type.qualificationname PHD (Engineering) en
dc.internal.availability Full text available en No embargo required en
dc.description.version Accepted Version
dc.contributor.funder Enterprise Ireland en
dc.contributor.funder Higher Education Authority en
dc.description.status Not peer reviewed en Electrical and Electronic Engineering en Tyndall National Institute en
dc.check.type No Embargo Required
dc.check.reason No embargo required en
dc.check.opt-out Not applicable en
dc.thesis.opt-out false
dc.check.embargoformat Not applicable en
dc.internal.conferring Autumn 2015 en

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© 2011, Pio Jesudoss. Except where otherwise noted, this item's license is described as © 2011, Pio Jesudoss.
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