MEMS based electrochemical process for fabrication of laminated micro-inductors on silicon

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dc.contributor.author Anthony, Ricky
dc.contributor.author Ó Mathúna, S. Cian
dc.contributor.author Rohan, James F.
dc.date.accessioned 2017-02-28T15:28:27Z
dc.date.available 2017-02-28T15:28:27Z
dc.date.issued 2016-02-11
dc.identifier.citation Anthony, R., O' Mathúna, C. and Rohan, J. F. (2016) 'MEMS based electrochemical process for fabrication of laminated micro-inductors on silicon', Microelectronic Engineering, 155, pp. 33-38. doi:10.1016/j.mee.2016.02.009 en
dc.identifier.volume 155 en
dc.identifier.startpage 33 en
dc.identifier.endpage 38 en
dc.identifier.issn 0167-9317
dc.identifier.uri http://hdl.handle.net/10468/3708
dc.identifier.doi 10.1016/j.mee.2016.02.009
dc.description.abstract Soft metallic magnetic alloys (such as Co, Ni and Fe based alloys) have been extensively used as core material in integrated inductors and transformers for DC–DC conversion. Although these materials have excellent soft magnetic properties such as high saturation flux density, low coercivity and high permeability; high electronic conductivity makes them susceptible to eddy current losses. As a result, core material thickness is often limited by the skin depth which in turn reduces the inductance density. Laminated magnetic films, where the active layers are separated by a dielectric film can increase the overall core thickness without compromising on its power handling capability. In this work, a CMOS compatible electrochemical-resist-electrochemical based core lamination deposition technique is demonstrated whereby a laminated top magnetic core is fabricated with a self-assembled and selective metallization process on the top SU-8 passivation layer with 2.5 μm Ni81Fe19. The process is site-selective, shows uniform deposition, has excellent step coverage and ideal for metallization of recessed regions in MEMS devices. Moreover, a high frequency measurement of laminated structure suggests uniform permeability for ~ 500 MHz applications. en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Elsevier en
dc.rights © 2016 Elsevier B.V. This manuscript version is made available under the CC-BY-NC-ND 4.0 license en
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/4.0/ en
dc.subject Integrated magnetics en
dc.subject Magnetic MEMS en
dc.subject Metallization en
dc.subject Electroless deposition en
dc.subject DC–DC Converter en
dc.title MEMS based electrochemical process for fabrication of laminated micro-inductors on silicon en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.check.info Access to this item is restricted until 24 months after publication by the request of the publisher. en
dc.check.date 2018-02-11
dc.date.updated 2017-02-28T15:18:41Z
dc.description.version Accepted Version en
dc.internal.rssid 352483094
dc.internal.rssid 477477056
dc.contributor.funder European Commission en
dc.contributor.funder Seventh Framework Programme en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Microelectronic Engineering en
dc.internal.copyrightchecked No !!CORA!! en
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress james.rohan@tyndall.ie en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en
dc.relation.project info:eu-repo/grantAgreement/EC/FP7::SP1::ICT/318529/EU/POWER SoC With Integrated PassivEs/POWERSWIPE en


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© 2016 Elsevier B.V. This manuscript version is made available under the CC-BY-NC-ND 4.0 license Except where otherwise noted, this item's license is described as © 2016 Elsevier B.V. This manuscript version is made available under the CC-BY-NC-ND 4.0 license
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