Development of nanostructured, stress-free Co-rich CoPtP films for magnetic microelectromechanical system applications

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Date
2007-05-08
Authors
Kulkarni, Santosh
Roy, Saibal
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AIP Publishing
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Abstract
Co-rich CoPtP alloys have been electrodeposited using direct current (dc) and pulse-reverse (PR) plating techniques. The surface morphology, crystalline structure, grain size, and magnetic properties of the plated films have been compared. The x-ray analysis and magnetic measurements reveal the presence of Co hcp hard magnetic phase with c axis perpendicular to the substrate for dc and in plane for PR plated films. The dc plated films have a granular structure in the micron scale with large cracks, which are manifestation of stress in the film. Only by using a combination of optimized PR plating conditions and stress relieving additive, we are able to produce 1-6 mu m thick (for 1 hour of plating), stress-free, and nanostructured (similar to 20 nm) Co-rich CoPtP single hcp phase at room temperature, with an intrinsic coercivity of 1500 Oe.
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Keywords
Pt thin-films , Anisotropy , Electrodeposition , Coercive force , Magnetic films , Sputter deposition , Microelectromechanical systems
Citation
Kulkarni, S. and Roy, S. (2007) 'Development of nanostructured, stress-free Co-rich CoPtP films for magnetic microelectromechanical system applications', Journal of Applied Physics, 101(9), pp. 09K524. doi: 10.1063/1.2712032
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© 2007 American Institute of Physics, This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Kulkarni, S. and Roy, S. (2007) 'Development of nanostructured, stress-free Co-rich CoPtP films for magnetic microelectromechanical system applications', Journal of Applied Physics, 101(9), pp. 09K524 and may be found at http://aip.scitation.org/doi/abs/10.1063/1.2712032