DC/DC converter 3D assembly for autonomous sensor nodes

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dc.contributor.author Hilt, Thierry
dc.contributor.author Boutry, Herve
dc.contributor.author Franiatte, Remi
dc.contributor.author Rothan, Frederic
dc.contributor.author Sillon, Nicolas
dc.contributor.author Stam, Frank
dc.contributor.author Mathewson, Alan
dc.contributor.author Wang, Ningning
dc.contributor.author Ó Mathúna, S. Cian
dc.contributor.author Rodgers, Kenneth
dc.date.accessioned 2011-12-14T12:45:27Z
dc.date.available 2011-12-14T12:45:27Z
dc.date.copyright 2010
dc.date.issued 2010-06-04
dc.identifier.citation Hilt, Thierry; Boutry, Herve; Franiatte, Remi; Rothan, Frederic; Sillon, Nicolas; Stam, Frank; Mathewson, Alan; Wang, Ningning; O'Mathuna, Cian; Rodgers, Kenneth; (2010) DC/DC converter 3D assembly for autonomous sensor nodes. In: Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. Las Vegas, USA, 01-04 Jun 2010. IEEE en
dc.identifier.startpage 834 en
dc.identifier.endpage 839 en
dc.identifier.uri http://hdl.handle.net/10468/474
dc.identifier.doi 10.1109/ECTC.2010.5490710
dc.description.abstract This paper reports on the design and the manufacturing of an integrated DCDC converter, which respects the specificity of sensor node network: compactness, high efficiency in acquisition and transmission modes, and compatibility with miniature Lithium batteries. A novel integrated circuit (ASIC) has been designed and manufactured to provide regulated Voltage to the sensor node from miniaturized, thin film Lithium batteries. Then, a 3D integration technique has been used to integrate this ASIC in a 3 layers stack with high efficiency passives components, mixing the wafer level technologies from two different research institutions. Electrical results have demonstrated the feasibility of this integrated system and experiments have shown significant improvements in the case of oscillations in regulated voltage. However, stability of this output voltage toward the input voltage has still to be improved. en
dc.description.sponsorship Science Foundation Ireland (CSET - Centre for Science, Engineering and Technology); European Commission (IST-026461) en
dc.description.uri http://www.ithermconference.org/ en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IEEE en
dc.relation.ispartof Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
dc.rights (c) 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works. en
dc.subject Application specific integrated circuits en
dc.subject Integrated circuit manufacture en
dc.subject.lcsh DC-to-DC converters en
dc.subject.lcsh Thin-film circuits en
dc.title DC/DC converter 3D assembly for autonomous sensor nodes en
dc.type Conference item en
dc.internal.authorcontactother Cian O Mathuna, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: cian.omathuna@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2011-12-05T15:57:54Z
dc.description.version Accepted Version en
dc.internal.rssid 116535482
dc.contributor.funder Science Foundation Ireland en
dc.contributor.funder European Commission en
dc.description.status Not peer reviewed en
dc.internal.copyrightchecked Yes Following guidelines from SHERPA RoMEO en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Las Vegas, NV, USA en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en
dc.relation.project IST-026461

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