Transfer print techniques for heterogeneous integration of photonic components

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dc.contributor.author Corbett, Brian M.
dc.contributor.author Loi, Ruggero
dc.contributor.author Zhou, Weidong
dc.contributor.author Liu, Dong
dc.contributor.author Ma, Zhenqiang
dc.date.accessioned 2017-09-26T11:39:19Z
dc.date.available 2017-09-26T11:39:19Z
dc.date.issued 2017
dc.identifier.citation Corbett, B., Loi, R., Zhou, W., Liu, D. and Ma, Z. (2017) 'Transfer print techniques for heterogeneous integration of photonic components', Progress in Quantum Electronics, 52 (17pp). doi: 10.1016/j.pquantelec.2017.01.001 en
dc.identifier.volume 52
dc.identifier.startpage 1
dc.identifier.endpage 17
dc.identifier.issn 0079-6727
dc.identifier.uri http://hdl.handle.net/10468/4783
dc.identifier.doi 10.1016/j.pquantelec.2017.01.001
dc.description.abstract The essential functionality of photonic and electronic devices is contained in thin surface layers leaving the substrate often to play primarily a mechanical role. Layer transfer of optimised devices or materials and their heterogeneous integration is thus a very attractive strategy to realise high performance, low-cost circuits for a wide variety of new applications. Additionally, new device configurations can be achieved that could not otherwise be realised. A range of layer transfer methods have been developed over the years including epitaxial lift-off and wafer bonding with substrate removal. Recently, a new technique called transfer printing has been introduced which allows manipulation of small and thin materials along with devices on a massively parallel scale with micron scale placement accuracies to a wide choice of substrates such as silicon, glass, ceramic, metal and polymer. Thus, the co-integration of electronics with photonic devices made from compound semiconductors, silicon, polymer and new 2D materials is now achievable in a practical and scalable method. This is leading to exciting possibilities in microassembly. We review some of the recent developments in layer transfer and particularly the use of the transfer print technology for enabling active photonic devices on rigid and flexible foreign substrates. en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Pergamon-Elsevier Science Ltd en
dc.relation.uri http://www.sciencedirect.com/science/article/pii/S0079672717300010?via%3Dihub
dc.rights © 2017, the Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/BY-NC-ND/4.0/). en
dc.rights.uri http://creativecommons.org/licenses/BY-NC-ND/4.0/
dc.subject Epitaxial lift off en
dc.subject Light emitting diodes en
dc.subject High efficiency en
dc.subject Solar cells en
dc.subject Silicon en
dc.subject Nanomembrane en
dc.subject Substrate en
dc.subject Photodetector en
dc.subject Transistors en
dc.subject Performance en
dc.title Transfer print techniques for heterogeneous integration of photonic components en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Brian M. Corbett, Tyndall National Institute, University College Cork, Cork, Ireland. +353-21-490-3000, Email: brian.corbett@tyndall.ie en
dc.internal.availability Full text available en
dc.description.version Published Version en
dc.internal.wokid WOS:000400726600001
dc.contributor.funder Air Force Office of Scientific Research
dc.contributor.funder Army Research Office
dc.contributor.funder National Science Foundation
dc.contributor.funder Horizon 2020
dc.contributor.funder Science Foundation Ireland
dc.description.status Peer reviewed en
dc.identifier.journaltitle Progress in Quantum Electronics en
dc.internal.IRISemailaddress b.corbett@ucc.ie en
dc.relation.project info:eu-repo/grantAgreement/EC/H2020::RIA/645314/EU/Transfer-print operations for heterogeneous integration/TOP HIT
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/


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© 2017, the Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/BY-NC-ND/4.0/). Except where otherwise noted, this item's license is described as © 2017, the Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/BY-NC-ND/4.0/).
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