Tailoring the ultra-soft magnetic properties of sputtered FineMET thin films for high-frequency power applications

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dc.contributor.author Masood, Ansar
dc.contributor.author McCloskey, Paul
dc.contributor.author Ó Mathúna, S. Cian
dc.contributor.author Kulkarni, Santosh
dc.contributor.author Masood, Ansar
dc.date.accessioned 2017-11-09T15:18:10Z
dc.date.available 2017-11-09T15:18:10Z
dc.date.issued 2017
dc.identifier.citation Masood, A., McCloskey, P., Ó Mathúna, C., and Kulkarni, S. (2017) 'Tailoring the ultra-soft magnetic properties of sputtered FineMET thin films for high-frequency power applications', Journal of Physics: Conference Series, 903(1), 012050 (3pp). doi: 10.1088/1742-6596/903/1/012050 en
dc.identifier.volume 903 en
dc.identifier.issued 1 en
dc.identifier.startpage 12050-1 en
dc.identifier.endpage 12050-3 en
dc.identifier.issn 1742-6596
dc.identifier.uri http://hdl.handle.net/10468/5003
dc.identifier.doi 10.1088/1742-6596/903/1/012050
dc.description.abstract This paper presents sputtered FineMET thin films with high saturation magnetic flux density and ultra-soft magnetic properties by maintaining an in-plane magnetization reversal process. The magnetic properties of FineMET thin films were investigated as a function of film thickness (40-517 nm) and annealing temperature (200-400 °C). The hysteresis loop study reveals that the films with low thickness (40 −316 nm) were perpendicularly magnetized in the as-deposited state. The ultra-soft magnetic properties (Hc =3 A/m) of the films were tailored by a thermal annealing process. A high relative permeability (μr ) of 1763 of these films with a good loss performance up to 1 GHz, makes them attractive for high-frequency power applications. en
dc.description.uri http://iopscience.iop.org/article/10.1088/1742-6596/903/1/011001 en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IOP Publishing en
dc.relation.uri http://stacks.iop.org/1742-6596/903/i=1/a=012050
dc.rights © 2017 IOP Publishing. Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Published under licence by IOP Publishing Ltd. en
dc.rights.uri https://creativecommons.org/licenses/by/3.0/ en
dc.subject FineMET thin films en
dc.subject Soft magnetic properties en
dc.subject Thin films en
dc.subject FineMET alloy en
dc.title Tailoring the ultra-soft magnetic properties of sputtered FineMET thin films for high-frequency power applications en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Cian Ó Mathúna, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: cian.omathuna@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2017-11-09T15:03:45Z
dc.description.version Published Version en
dc.internal.rssid 418158489
dc.contributor.funder Collaborative Centre for Applied Nanotechnology en
dc.contributor.funder Enterprise Ireland en
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Journal of Physics: Conference Series en
dc.internal.copyrightchecked No !!CORA!! en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Glasgow, United Kingdom
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en


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© 2017 IOP Publishing. Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Published under licence by IOP Publishing Ltd. Except where otherwise noted, this item's license is described as © 2017 IOP Publishing. Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Published under licence by IOP Publishing Ltd.
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