Miniaturised multi-MEMS sensor development

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dc.contributor.author Hautefeuille, Mathieu
dc.contributor.author O'Flynn, Brendan
dc.contributor.author Peters, Frank H.
dc.contributor.author O'Mahony, Conor
dc.date.accessioned 2009-06-23T16:03:32Z
dc.date.available 2009-06-23T16:03:32Z
dc.date.copyright 2009
dc.date.issued 2009-06
dc.identifier.citation Hautefeuille, M., O'Flynn, B., Peters, F.H., O'Mahony, C., 2009. Miniaturised multi-MEMS sensor development. Microelectronics Reliability, 49 (6) pp.621-626. en
dc.identifier.volume 49 en
dc.identifier.issued 6 en
dc.identifier.startpage 621 en
dc.identifier.endpage 626 en
dc.identifier.issn 0026-2714
dc.identifier.uri http://hdl.handle.net/10468/51
dc.identifier.doi 10.1016/j.microrel.2009.02.017
dc.description.abstract This paper describes the design, fabrication and initial characterisation of a MEMS-based environmental monitoring system. Intended for use with miniaturised Wireless Sensor Network (WSN) motes, the die measures 3 × 3 mm and incorporates humidity, temperature, corrosion, gas and gas flow velocity sensors on a single substrate. Fabricated using a combination of surface and bulk micromachining technologies, the sensor system is designed to replace discrete components on WSN module boards, thereby minimising space consumption and enabling smaller, cheaper wireless motes. Sensors have been characterised over a wide range of environmental conditions. An analysis of the effects of changes in environmental parameters other than the measurand of interest on the performance of the temperature and humidity sensors has been carried out, and corrections applied where necessary. A variety of corrosion monitors have been demonstrated. A gas flow velocity sensor, based on forced convective heat transfer and which has been thermally isolated from the silicon substrate in order to reduce power consumption and improve sensitivity at low flow-rates, has also been presented. The paper also outlines the design of the next generation sensing platform using the novel 10 mm wireless cube developed at Tyndall. en
dc.description.sponsorship Science Foundation Ireland (CSET - Centre for Science Engineering and Technology) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Elsevier en
dc.rights Copyright © 2009 Elsevier Ltd All rights reserved. en
dc.subject Microelectromechanical devices en
dc.subject Environmental management systems en
dc.subject Micromachining en
dc.subject.lcsh Microelectromechanical systems en
dc.subject.lcsh Environmental sampling en
dc.subject.lcsh Wireless sensor networks en
dc.title Miniaturised multi-MEMS sensor development en
dc.type Article (peer-reviewed) en
dc.internal.authorurl http://www.tyndall.ie/mai/staff/mathieuhautefeuille.htm en
dc.internal.authorurl http://www.tyndall.ie/mai/staff/brendanoflynn.htm en
dc.internal.authorurl http://www.physics.ucc.ie/fpetersweb/fpeters.html en
dc.internal.authorcontactother Mathieu Hautefeuille, Centre for Telecommunication Value-Chain Research, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: mathieu.hautefeuille@tyndall.ie en
dc.internal.authorcontactother Brendan O'Flynn, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: brendan.oflynn@tyndall.ie en
dc.internal.authorcontactother Frank Peters, Physics Department, University College Cork, Ireland. Email: F.Peters@ucc.ie en
dc.internal.authorcontactother Conor O'Mahony, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: conor.omahony@tyndall.ie en
dc.internal.availability Full text available en
dc.internal.webversions http://www.sciencedirect.com/science/article/B6V47-4VY6FVS-1/2/94b155434960f5017e3d7fe52af88ade en
dc.description.version Accepted Version en
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Microelectronics Reliability en


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