Miniaturization of wireless sensor network nodes

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dc.contributor.author Zheng, Liqiang
dc.contributor.author Mathewson, Alan
dc.contributor.author O'Flynn, Brendan
dc.contributor.author Hayes, Michael
dc.contributor.author Ó Mathúna, S. Cian
dc.date.accessioned 2012-02-21T13:11:27Z
dc.date.available 2012-02-21T13:11:27Z
dc.date.issued 2010
dc.identifier.citation Zheng, L.; Mathewson, A.; O Flynn, B.; Hayes, M.; Ó Mathúna, S.C. (2010) 'Miniaturization of wireless sensor network nodes'. Carpathian Journal of Electronic and Computer Engineering, 3 (1):43-48. en
dc.identifier.volume 3 en
dc.identifier.issued 1 en
dc.identifier.startpage 43 en
dc.identifier.endpage 48 en
dc.identifier.issn 1844-9689
dc.identifier.uri http://hdl.handle.net/10468/528
dc.description.abstract Wireless sensor network (WSN) node, typically equipped with a radio transceiver, a small microcontroller and a battery, is different from traditional embedded systems because of its requirement of random deployment, small size and low power consumption. Based on these reasons, miniaturization of the WSN nodes becomes increasingly crucial in embedded system design for numerous applications, such as bio-medical monitoring and body network. In this paper, several technologies of different packaging levels to achieve miniaturization and integration are presented, including flip chip packaging of transceiver and micro-controller bare dies, embedded capacitance and epoxy based three dimensional integration technologies. Comparison of the proposed technologies with the original traditional PCB WSN mote is provided. The current experiments and measurements are also presented to show the benefits brought by these technologies not only in shrinking of the mote size, but also some improvements in electrical performance such as reduction of parasitic passives. It is possible to utilizing several different miniaturization technologies for future miniaturized WSN nodes design. Comparison of these technologies in WSN application is provided as conclusion of this paper . en
dc.description.sponsorship Science Foundation Ireland (CSET - Centre for Science, Engineering and Technology, grant 07/CE/I1147) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Editura Universitatii de Nord en
dc.relation.uri http://ece.ubm.ro/cjece/past_issues.html
dc.rights © 2010, CJECE. en
dc.subject Embedded capacitance material (ECM) en
dc.subject Bare die flip-chip en
dc.subject Epoxy based 3D technology en
dc.subject Packaging technologies en
dc.subject.lcsh Wireless sensor nodes en
dc.subject.lcsh Flip chip technology en
dc.title Miniaturization of wireless sensor network nodes en
dc.type Article (peer-reviewed) en
dc.internal.authorurl http://www.tyndall.ie en
dc.internal.authorcontactother Liqiang Zheng, Tyndall National Institute, University College Cork, Lee Maltings, Cork, Ireland. Email: liqiang.zheng@tyndall.ie en
dc.internal.authorcontactother Alan Mathewson, Tyndall National Institute, University College Cork, Lee Maltings, Cork, Ireland. Email: alan.mathewson@tyndall.ie en
dc.internal.authorcontactother Brendan O'Flynn, Tyndall National Institute, University College Cork, Lee Maltings, Cork, Ireland. Email: brendan.oflynn@tyndall.ie en
dc.internal.authorcontactother Mike Hayes, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: michael.hayes@tyndall.ie en
dc.internal.authorcontactother Cian O Mathuna, Tyndall National Institute, University College Cork, Lee Maltings, Cork, Ireland. Email: cian.omathuna@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2012-02-21T12:40:59Z
dc.description.version Accepted Version en
dc.internal.rssid 126936651
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Carpathian Journal of Electronic and Computer Engineering en
dc.internal.copyrightchecked Yes CJECE. Permission granted by Dr. Alin Tisan, CJECE Editorial Office 14 Feb 2012 en
dc.internal.licenseacceptance Yes en
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Centre for Science Engineering and Technology (CSET)/07/CE/I1147/IE/CSET CLARITY: Bringing Information to Life/


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