128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre array

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dc.contributor.author Hwang, How Yuan
dc.contributor.author Morrissey, Padraic E.
dc.contributor.author Lee, Jun Su
dc.contributor.author O'Brien, Peter A.
dc.contributor.author Henriksson, Johannes
dc.contributor.author Wu, Ming C.
dc.contributor.author Seok, Tae Joon
dc.date.accessioned 2018-08-24T10:31:34Z
dc.date.available 2018-08-24T10:31:34Z
dc.date.issued 2017-12
dc.identifier.citation Hwang, H. Y., Morrissey, P., Lee, J. S., Brien, P. O., Henriksson, J., Wu, M. C. and Seok, T. J. (2017) '128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre array', 2017 19th Electronics Packaging Technology Conference, Singapore, 6-9 Dec. (4 pp). doi:10.1109/EPTC.2017.8277436 en
dc.identifier.startpage 1 en
dc.identifier.endpage 4 en
dc.identifier.isbn 978-1-5386-3042-6
dc.identifier.isbn 978-1-5386-3041-9
dc.identifier.issn 978-1-5386-3043-3
dc.identifier.uri http://hdl.handle.net/10468/6637
dc.identifier.doi 10.1109/EPTC.2017.8277436
dc.description.abstract We design and fabricate the packaging of 128 × 128 silicon photonic MEMS switch device using through glass via (TGV) interposer and pitch reducing fibre array. The switch device contains 16384 MEMS switch cells and 272 grating couplers spaced at 63.5 μm in a compact footprint of 17.4 mm × 16 mm. The apodised grating couplers designed for 1300 nm have an insertion loss of 2.5 dB/facet at 10° coupling angle. The 0.5 mm thick glass interposer contains 512 electrical vias while the pitch reducing optical coupling array is polished to 40° for planar coupling. en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.relation.ispartof 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
dc.relation.uri https://ieeexplore.ieee.org/document/8277436/?section=abstract
dc.rights © 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Diffraction gratings en
dc.subject Elemental semiconductors en
dc.subject Integrated optics en
dc.subject Integrated optoelectronics en
dc.subject Micro-optomechanical devices en
dc.subject Microswitches en
dc.subject Optical communication equipment en
dc.subject Optical design techniques en
dc.subject Optical fibre couplers en
dc.subject Optical fibre losses en
dc.subject Optical switches en
dc.subject Silicon en
dc.subject Silicon photonic MEMS switch package en
dc.subject Pitch reducing fibre array en
dc.subject Insertion loss en
dc.subject Planar coupling en
dc.subject Optical coupling array en
dc.subject Apodised grating couplers en
dc.subject Switch device en
dc.subject Glass interposer en
dc.subject Size 63.5 mum en
dc.subject Size 17.4 mm en
dc.subject Size 16.0 mm en
dc.subject Size 0.5 mm en
dc.subject Wavelength 1300.0 nm en
dc.subject Optical fibers en
dc.subject Photonics en
dc.subject Optical coupling en
dc.title 128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre array en
dc.type Article (peer-reviewed) en
dc.type Conference item en
dc.internal.authorcontactother How Yuan Hwang, Tyndall National Institute, University College Cork, Cork, Ireland. +353-21-490-3000 Email: howyuan.hwang@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2018-08-24T09:29:20Z
dc.description.version Accepted Version en
dc.internal.rssid 450781334
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle 2017 19th Electronics Packaging Technology Conference en
dc.internal.copyrightchecked No !!CORA!! en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Singapore en
dc.internal.IRISemailaddress howyuan.hwang@tyndall.ie en
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/ en

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