Impact study of substrate materials on wireless sensor node RF performance

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dc.contributor.author Zheng, Liqiang
dc.contributor.author Mathewson, Alan
dc.contributor.author O'Flynn, Brendan
dc.contributor.author Hayes, Michael
dc.contributor.author Ó Mathúna, S. Cian
dc.contributor.editor Ming Huang, Yuan
dc.date.accessioned 2012-09-06T11:37:17Z
dc.date.available 2012-09-06T11:37:17Z
dc.date.issued 2010-08
dc.identifier.citation Zheng, Liqiang; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michael; Ó Mathúna, S. Cian (2010) Impact study of substrate materials on wireless sensor node RF performance. Materials Science Forum, 663-665, pp. 455-461. doi: 0.4028/www.scientific.net/MSF.663-665.455 en
dc.identifier.volume 663-665 en
dc.identifier.startpage 455 en
dc.identifier.endpage 461 en
dc.identifier.issn 1662-9752
dc.identifier.uri http://hdl.handle.net/10468/701
dc.identifier.doi 10.4028/www.scientific.net/MSF.663-665.455
dc.description.abstract In this paper, the effect of the substrate on wireless sensor network (WSN) node s RF performance is studied experimentally by using different substrate materials with different thickness. A six-layer FR4 substrate PCB WSN node is fabricated and compared with the original two-layer FR4 PCB node to show the impact of substrate material thickness. Also different substrate dielectric constants impacts are studied by the same method. All these demonstrators are modeling by RF circuit analysis method and simulated in the Ansoft Designer software. Simulation results match the experimental measurement. An optimization method based on simulation for WSN node design with different substrate is presented. This analysis, modeling, simulation and optimization procedure can be carried out on some novel substrate materials such as LTCC and LCP. en
dc.description.sponsorship Science Foundation Ireland (ITOBO (398-CRP)); Science Foundation Ireland (CSET - Centre for Science, Engineering and Technology, grant 07/CE/I1147) en
dc.description.uri http://www.oeem.org/ en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher © (2011) Trans Tech Publications, Switzerland en
dc.relation.ispartof 2010 International Conference on Optical, Electronic and Electrical Materials
dc.relation.uri http://www.scientific.net/MSF.663-665.455
dc.rights © (2011) Trans Tech Publications, Switzerland en
dc.subject Substrate impact en
dc.subject RF circuit modeling en
dc.subject Return loss en
dc.subject Optimization en
dc.title Impact study of substrate materials on wireless sensor node RF performance en
dc.type Article (peer-reviewed) en
dc.internal.authorurl http://www.tyndall.ie en
dc.internal.authorcontactother Brendan O'Flynn, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: brendan.oflynn@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2012-09-06T11:25:53Z
dc.description.version Accepted Version en
dc.internal.rssid 165504260
dc.internal.rssid 276842357
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Materials Science Forum en
dc.internal.copyrightchecked Yes en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Kunming, China en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en


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