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Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators
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Accepted version
Date
2019-11-30
Authors
Liu, Lei
Loi, Ruggero
Roycroft, Brendan
O'Callaghan, James
Trindade, António José
Kelleher, Steven
Gocalińska, Agnieszka M.
Thomas, Kevin K.
Pelucchi, Emanuele
Bower, Christopher A.
Journal Title
Journal ISSN
Volume Title
Publisher
IOP Publishing
Published Version
Abstract
On-chip optical interconnects heterogeneously integrated on silicon wafers by transfer-print technology are presented for the first time. Thin (<5 µm), micron sized light-emitting diodes (LEDs) and photo diodes (PDs) are prefabricated and transfer-printed to silicon wafer with polymer waveguides built between them. Data transmission with total power consumption as low as 1 mW, signal to noise ratio of >250 and current transfer ratio of 0.1% in a compact volume of <0.0004 mm3 are demonstrated. Experiment shows that the polymer waveguide between the LED and PD plays a key role in enhancing the data transmission efficiency. Reciprocal performance for bidirectional transmission is also achieved. The results show the potential for cost-effective and low profile form-factor on-chip opto-isolators.
Description
Keywords
Optical interconnects , Photonic integrated circuits , Heterogeneous integration
Citation
Lei, L., Ruggero, L., Brendan, R., James, O. C., Antonio Jose, T., Steven, K., Agnieszka, G., Kevin, T., Emanuele, P., Christopher, A. B. and Brian, C. (2019) 'Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators', Journal of Physics D: Applied Physics, 52(6), 064001 (9 pp). doi: 10.1088/1361-6463/aaf064