Integrated microinductors on semiconductor substrates for power supply on chip (Invited)

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dc.contributor.author Rohan, James F.
dc.contributor.author Casey, Declan P.
dc.contributor.author O'Brien, Joe
dc.contributor.author Hegarty, Margaret
dc.contributor.author Kelleher, Anne-Marie
dc.contributor.author Wang, Ningning
dc.contributor.author Jamieson, Brice
dc.contributor.author Waldron, Finbarr
dc.contributor.author Kulkarni, Santosh
dc.contributor.author Roy, Saibal
dc.contributor.author Ó Mathúna, S. Cian
dc.date.accessioned 2019-03-11T12:31:27Z
dc.date.available 2019-03-11T12:31:27Z
dc.date.issued 2011-01
dc.identifier.citation Rohan, J. F., Casey, D., O'Brien, J., Hegarty, M., Kelleher, A.-M., Wang, N., Jamieson, B., Waldron, F., Kulkarni, S., Roy, S. and O'Mathuna, S. C. (2011) '(Invited) Integrated Microinductors on Semiconductor Substrates for Power Supply on Chip', ECS Transactions, 41(8), pp. 341-347. doi: 10.1149/1.3631510 en
dc.identifier.volume 41 en
dc.identifier.issued 8 en
dc.identifier.startpage 341 en
dc.identifier.endpage 347 en
dc.identifier.issn 1938-5862
dc.identifier.uri http://hdl.handle.net/10468/7598
dc.identifier.doi 10.1149/1.3631510
dc.description.abstract Microinductors were fabricated using electrodeposition for integration on semiconductor substrates. The process was optimised through validated models developed to focus on efficiency and footprint. Lithographic processing was performed to microfabricate Cu coils over a magnetic core. A racetrack design was used to maximise the high frequency response, yielding high inductance density and low DC resistance. The magnetic core was subsequently closed using a magnetic thin film deposition over a dielectric deposited on the Cu coils. Homogeneous ferromagnetic alloy, Ni45Fe55 of uniform thickness over a high aspect-ratio 3D structure has been achieved. Ni45Fe55 was chosen for the fabrication of micromagnetic cores due to its relatively high saturation flux density (1.6 T), resistivity (48 mΩ cm) and anisotropy field (9.5 Oe). The rationale, design, microfabrication process and characterisation results are presented. en
dc.description.sponsorship Enterprise Ireland (commercialisation fund technology development project CFTD/2008/331); Higher Education Authority (“INSPIRE” Higher Education Authority via PRTLI4) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Electrochemical Society en
dc.relation.uri http://ecst.ecsdl.org/content/41/8/341
dc.rights © 2011 ECS - The Electrochemical Society en
dc.subject Aspect ratio en
dc.subject Gallium nitride en
dc.subject Magnetic cores en
dc.subject Magnetic thin films en
dc.subject Silicon carbide en
dc.subject 3D Structure en
dc.subject Anisotropy field en
dc.subject Dc resistance en
dc.subject Ferromagnetic alloys en
dc.subject High aspect ratio en
dc.subject High frequency response en
dc.subject Lithographic processing en
dc.subject Micro inductors en
dc.subject Microfabrication process en
dc.subject Micromagnetics en
dc.subject Power supply-on-chip en
dc.subject Saturation flux density en
dc.subject Semiconductor substrate en
dc.subject Thin-film depositions en
dc.title Integrated microinductors on semiconductor substrates for power supply on chip (Invited) en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-03-11T12:25:14Z
dc.description.version Accepted Version en
dc.internal.rssid 259773569
dc.internal.rssid 483475693
dc.contributor.funder Enterprise Ireland en
dc.contributor.funder Higher Education Authority en
dc.description.status Peer reviewed en
dc.identifier.journaltitle ECS Transactions en
dc.internal.copyrightchecked No !!CORA!! en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Boston, MA; United States en
dc.internal.IRISemailaddress james.rohan@tyndall.ie en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie


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