Influence of carbon nanotubes on the electrodeposition of copper interconnects

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dc.contributor.author Chowdhury, Tamjid
dc.contributor.author Rohan, James F.
dc.date.accessioned 2019-03-11T12:49:29Z
dc.date.available 2019-03-11T12:49:29Z
dc.date.issued 2010-01
dc.identifier.citation Chowdhury, T. and Rohan, J. F. (2010) 'Influence of Carbon Nanotubes on the Electrodeposition of Copper Interconnects', ECS Transactions, 25(38), pp. 37-46. doi: 10.1149/1.3390656 en
dc.identifier.volume 25 en
dc.identifier.issued 38 en
dc.identifier.startpage 37 en
dc.identifier.endpage 46 en
dc.identifier.issn 1938-5862
dc.identifier.uri http://hdl.handle.net/10468/7600
dc.identifier.doi 10.1149/1.3390656
dc.description.abstract The electrochemistry of the co-deposition of Cu with carbon nanotube, CNTs is studied by voltammetry and chronoamperometry experiments. Electrochemical data shows CNTs have a slightly accelerating influence on the Cu electrodeposition when nafion was added in the bath as a surfactant of CNTs. The amount of CNTs in the deposit is up to 2% by weight. Kinetic data confirms that the addition of CNTs to the Cu baths increases the Cu exchange current density and decreases the equilibrium potential value. The electrical resistivity results show that at room temperature the resistivity of Cu/CNT composites film (2.47 μΩ-cm) is close to the resistivity of Cu film (2.15 μΩ-cm). A clear decrease of sample resistivity is observed with increasing anneal temperature upto 315ºC. The resistivity also increases when the concentration of CNTs is increased from 10 mg/l to 100 mg/l in the bath. en
dc.description.sponsorship Irish Research Council for Science, Engineering and Technology (IRCSET postgraduate scholarship Enterprise Partnership scheme in collaboration with Intel Ireland Ltd., funded by the National Development Plan) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Electrochemical Society en
dc.relation.uri http://ecst.ecsdl.org/content/25/38/37
dc.rights © 2010 ECS - The Electrochemical Society en
dc.subject Copper en
dc.subject Carbon nanotubes en
dc.subject Chronoamperometry en
dc.subject Composite films en
dc.subject Electric conductivity en
dc.subject Electrodeposition en
dc.subject Surface active agents en
dc.subject Three dimensional en
dc.subject Anneal temperatures en
dc.subject Codeposition en
dc.subject Copper interconnects en
dc.subject Cu exchanges en
dc.subject Cu films en
dc.subject Electrical resistivity en
dc.subject Electrochemical data en
dc.subject Equilibrium potentials en
dc.subject Kinetic data en
dc.subject Room temperature en
dc.title Influence of carbon nanotubes on the electrodeposition of copper interconnects en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-03-11T12:44:07Z
dc.description.version Accepted Version en
dc.internal.rssid 352483104
dc.contributor.funder Irish Research Council for Science, Engineering and Technology en
dc.contributor.funder Intel Corporation en
dc.description.status Peer reviewed en
dc.identifier.journaltitle ECS Transactions en
dc.internal.copyrightchecked No !!CORA!! en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Vienna; Austria en
dc.internal.IRISemailaddress james.rohan@tyndall.ie en


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