Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications

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dc.contributor.author Rohan, James F.
dc.contributor.author O'Riordan, Gerald
dc.contributor.author Boardman, Jane
dc.date.accessioned 2019-03-14T11:59:30Z
dc.date.available 2019-03-14T11:59:30Z
dc.date.issued 2001-12-11
dc.identifier.citation Rohan, J. F., O’Riordan, G. and Boardman, J. (2002) 'Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications', Applied Surface Science, 185(3), pp. 289-297. doi: 10.1016/S0169-4332(01)00982-5 en
dc.identifier.volume 185 en
dc.identifier.startpage 289 en
dc.identifier.endpage 297 en
dc.identifier.issn 0169-4332
dc.identifier.uri http://hdl.handle.net/10468/7623
dc.identifier.doi 10.1016/S0169-4332(01)00982-5
dc.description.abstract A low cost, selective electroless metallisation of integrated circuit (IC) copper bond pads with nickel and gold is demonstrated. This metallurgy can function as a barrier layer/bondable material when deposited as a thin layer or as the chip bump for flip chip applications when deposited to greater heights. Four alternative activation steps for selective electroless nickel deposition on bond pad copper are demonstrated. Selective low cost deposition has been achieved with a proprietary electroless plating bath developed at NMRC and three commercial baths on both sputtered copper substrates and electrolessly deposited copper on titanium nitride barrier layer material. en
dc.description.sponsorship Enterprise Ireland (Grant number HE1999-262 from the Enterprise Ireland Applied Research Grant Scheme) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Elsevier en
dc.relation.uri http://www.sciencedirect.com/science/article/pii/S0169433201009825
dc.rights © 2002 Published by Elsevier Science B.V. This manuscript version is made available under the CC-BY-NC-ND 4.0 license en
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/4.0/ en
dc.subject Electroless deposition en
dc.subject Copper bond pads en
dc.subject Barrier layer en
dc.subject Flip chip en
dc.title Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-03-14T11:54:49Z
dc.description.version Accepted Version en
dc.internal.rssid 43338439
dc.internal.wokid 000173623300017
dc.contributor.funder Enterprise Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Applied Surface Science en
dc.internal.copyrightchecked No !!CORA!! en
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress james.rohan@tyndall.ie en


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© 2002 Published by Elsevier Science B.V. This manuscript version is made available under the CC-BY-NC-ND 4.0 license Except where otherwise noted, this item's license is described as © 2002 Published by Elsevier Science B.V. This manuscript version is made available under the CC-BY-NC-ND 4.0 license
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