Speckle mitigation in laser Doppler vibrometry based on a compact silicon photonics chip
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Accepted Version
Date
2018-05
Authors
Li, Yanlu
Zhu, Jinghao
Duperron, Matthieu
O'Brien, Peter A.
Schüler, Ralf
Aasmul, Soren
De Melis, Mirko
Baets, Roel
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
Abstract
A compact six-beam homodyne laser Doppler vibrometry (LDV) system is realized based on a silicon-on-insulator (SOI) photonic integrated circuit. We demonstrate a speckle mitigation method by averaging signals from the six channels.
Description
Keywords
Doppler measurement , Elemental semiconductors , Homodyne detection , Integrated optics , Measurement by laser beam , Silicon , Silicon-on-insulator , Speckle , Vibration measurement , Compact silicon photonics chip , Silicon-on-insulator photonic integrated circuit , Speckle mitigation method , Compact six-beam homodyne laser Doppler vibrometry system , Averaging signals , Biophotonics , Packaging
Citation
Li, Y., Zhu, J., Duperron, M., O'Brien, P., Schüler, R., Aasmul, S., De Melis, M. and Baets, R. (2018) ‘Speckle mitigation in laser Doppler vibrometry based on a compact silicon photonics chip’, 2018 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 13-18 May, ATu3I.5 (2pp). doi:10.1364/CLEO_AT.2018.ATu3I.5
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