High-aspect-ratio photoresist processing for fabrication of high resolution and thick micro-windings

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dc.contributor.author Anthony, Ricky
dc.contributor.author Laforge, Elias
dc.contributor.author Casey, Declan P.
dc.contributor.author Rohan, James F.
dc.contributor.author Ó Mathúna, S. Cian
dc.date.accessioned 2019-03-21T14:34:26Z
dc.date.available 2019-03-21T14:34:26Z
dc.date.issued 2016-09-07
dc.identifier.citation Anthony, R., Laforge, E., Casey, D. P., Rohan, J. F. and O’Mathuna, C. (2016) 'High-aspect-ratio photoresist processing for fabrication of high resolution and thick micro-windings', Journal of Micromechanics and Microengineering, 26(10), 105012 (9 pp). doi: 10.1088/0960-1317/26/10/105012 en
dc.identifier.volume 26 en
dc.identifier.issued 10 en
dc.identifier.startpage 1 en
dc.identifier.endpage 9 en
dc.identifier.issn 0960-1317;1361-6439
dc.identifier.uri http://hdl.handle.net/10468/7656
dc.identifier.doi 10.1088/0960-1317/26/10/105012
dc.description.abstract DC winding losses remain a major roadblock in realizing high efficiency micro-magnetic components (inductors/transformers). This paper reports an optimized photoresist process using negative tone and acrylic based THB-151N (from JSR Micro), to achieve one of the highest aspect ratio (17:1) and resolution (~5 µm) resist patterns for fabrication of thick (~80 µm) micro-winding using UV lithography. The process was optimized to achieve photoresist widths from 5 µm to 20 µm with resist thickness of ~85 µm in a single spin step. Unlike SU-8, this resist can be readily removed and shows a near-vertical (~91°) electroplated Cu side-wall profile. Moreover, the high resolution compared to available resist processes enables a further reduction in the footprint area and can potentially increase the number of winding thereby increasing the inductance density for micro-magnetic components. Resistance measurements of electroplated copper winding of air-core micro-inductors within the standard 0402 size (0.45 mm2 footprint area) suggested a 42% decrease in resistance (273 mΩ–159 mΩ) with the increase in electroplated Cu thickness (from 50 µm to 80 µm). Reduction of the spacings (from 10 µm to 5 µm) enabled further miniaturisation of the device footprint area (from 0.60 mm2 to 0.45 mm2) without significant increase in resistance. en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IOP Publishing en
dc.relation.uri https://iopscience.iop.org/article/10.1088/0960-1317/26/10/105012
dc.rights © 2016 IOP Publishing Ltd. This is an author-created, un-copyedited version of an article accepted for publication in Journal of Micromechanics and Microengineering. The publisher is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/0960-1317/26/10/105012 en
dc.subject High aspect ratio en
dc.subject High resolution en
dc.subject MEMS en
dc.subject Integrated magnetics en
dc.subject Photolithography en
dc.title High-aspect-ratio photoresist processing for fabrication of high resolution and thick micro-windings en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-03-21T14:29:37Z
dc.description.version Accepted Version en
dc.internal.rssid 468876268
dc.contributor.funder Seventh Framework Programme en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Journal of Micromechanics and Microengineering en
dc.internal.copyrightchecked No !!CORA!! en
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress james.rohan@tyndall.ie en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en
dc.relation.project info:eu-repo/grantAgreement/EC/FP7::SP1::ICT/318529/EU/POWER SoC With Integrated PassivEs/POWERSWIPE en

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