Electroless metal deposition for IC and TSV applications

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dc.contributor.author Rohan, James F.
dc.contributor.author Casey, Declan P.
dc.contributor.author Zygowska, Monika
dc.contributor.author Moore, Michael
dc.contributor.author Shanahan, Brian
dc.date.accessioned 2019-03-22T16:10:24Z
dc.date.available 2019-03-22T16:10:24Z
dc.date.issued 2014-12
dc.identifier.citation Rohan, J. F., Casey, D., Zygowska, M., Moore, M. and Shanahan, B. (2014) 'Electroless metal deposition for IC and TSV applications', 2014 International 3D Systems Integration Conference (3DIC), Kinsale, Cork, Ireland 1-3 December, (3 pp). doi: 10.1109/3DIC.2014.7152175 en
dc.identifier.startpage 1 en
dc.identifier.endpage 3 en
dc.identifier.isbn 978-1-4799-8472-5
dc.identifier.uri http://hdl.handle.net/10468/7666
dc.identifier.doi 10.1109/3DIC.2014.7152175
dc.description.abstract Ultrathin film electroless deposition of Cu and Ni is shown for IC and TSV barrier layer / interconnect applications as an alternative to vacuum based deposition techniques. Cu films of approximately 20 nm were achieved while coherent electroless Ni can be deposited to single digit nm levels. The use of self-assembled monolayers facilitates electroless deposition in high aspect ratio structures. This activation process in combination with ultrathin film barrier/seed layer deposition by electroless processing enables scaling for both IC and TSV interconnect applications. en
dc.description.sponsorship Enterprise Ireland and IDA Ireland (iTech project within CCAN - the Collaborative Centre for Applied Nanotechnology (www.ccan.ie), supported by Enterprise Ireland & IDA Ireland (grant no. CC/2012/06a)); Enterprise Ireland (Enterprise Ireland Commercialisation Fund project Intecell (grant no. CF/2012/2341) co-funded by Enterprise Ireland and the European Regional Development Fund (ERDF) under the National Strategic Reference Framework (NSRF) 2014-2020) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.relation.ispartof 3D Systems Integration Conference (3DIC), 2014 International
dc.relation.uri https://ieeexplore.ieee.org/document/7152175
dc.rights © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Electroless en
dc.subject Metal en
dc.subject Deposition en
dc.subject Thin film en
dc.subject Interconnect en
dc.subject Barrier layers en
dc.subject TSV en
dc.subject Films en
dc.subject Nickel en
dc.subject Silicon en
dc.subject Substrates en
dc.subject Integrated circuits en
dc.subject Oxidation en
dc.subject Copper en
dc.subject Electroless deposition en
dc.subject Integrated circuit interconnections en
dc.subject Metallic thin films en
dc.subject Monolayers en
dc.subject Nickel en
dc.subject Self-assembly en
dc.subject Three-dimensional integrated circuits en
dc.title Electroless metal deposition for IC and TSV applications en
dc.type Conference item en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-03-22T16:01:47Z
dc.description.version Accepted Version en
dc.internal.rssid 352483090
dc.contributor.funder Enterprise Ireland en
dc.contributor.funder Science Foundation Ireland en
dc.contributor.funder European Regional Development Fund en
dc.contributor.funder IDA Ireland en
dc.description.status Peer reviewed en
dc.internal.copyrightchecked No !!CORA!! en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Kinsale, Cork, Ireland en
dc.internal.IRISemailaddress james.rohan@tyndall.ie en
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Technology and Innovation Development Award (TIDA)/12/TIDA/I2355/IE/Probing the limits of ultrathin solution based meral and alloy deposition/ en


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