High frequency DC-DC converter with co-packaged planar inductor and power IC

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dc.contributor.author Wang, Ningning
dc.contributor.author Barry, John
dc.contributor.author Hannon, Jason
dc.contributor.author Kulkarni, Santosh
dc.contributor.author Foley, Ray
dc.contributor.author McCarthy, Kevin G.
dc.contributor.author Rodgers, Kenneth
dc.contributor.author Waldron, Finbarr
dc.contributor.author Barry, Mark
dc.contributor.author Casey, Declan P.
dc.contributor.author Rohan, James F.
dc.contributor.author O'Brian, Joe
dc.contributor.author Hegarty, Margaret
dc.contributor.author Kelleher, Ann-Marie
dc.contributor.author Roy, Saibal
dc.contributor.author Ó Mathúna, S. Cian
dc.date.accessioned 2019-03-26T10:08:15Z
dc.date.available 2019-03-26T10:08:15Z
dc.date.issued 2013-05
dc.identifier.citation Wang, N., Barry, J., Hannon, J., Kulkarni, S., Foley, R., McCarthy, K., Rodgers, K., Waldron, F., Barry, M., Casey, D., Rohan, J., O'Brian, J., Hegarty, M., Kelleher, A.-M., Roy, S. and Ó Mathúna, C. (2013) ‘High frequency DC-DC converter with co-packaged planar inductor and power IC’, 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, USA, 28-31 May, pp. 1946-1952. doi:10.1109/ECTC.2013.6575844 en
dc.identifier.startpage 1946 en
dc.identifier.endpage 1952 en
dc.identifier.isbn 978-1-4799-0233-0
dc.identifier.isbn 978-1-4799-0232-3
dc.identifier.issn 2377-5726
dc.identifier.issn 0569-5503
dc.identifier.uri http://hdl.handle.net/10468/7675
dc.identifier.doi 10.1109/ECTC.2013.6575844
dc.description.abstract The paper introduces the trend of integration and miniaturization of power converters with potential for enhanced efficiency, form factor reduction and cost reduction. To demonstrate the concept of highly integrated switched mode power supply with integrated magnetic, a system-in-package DC-DC converter using a stacked co-packaging approach is developed. A system approach was taken to the design, and functional integration, using 3-D packaging for realizing a power supply in package solution (PwrSiP). The target integrated converter is capable of handling an input voltage of 5V and frequencies up to 40MHz. A DC-DC converter IC on a 0.35μm CMOS process was designed to meet this goal. In parallel with the IC design, technology development for on-silicon integrated micro-inductors was completed to achieve small-form factor and extremely low profile. A maximum measured efficiency of 83% and 78% was achieved on the stacked converter operating at 20MHz and 40MHz, respectively. The stacked approach showed a 30% area reduction compared to side-by-side implementation with external discrete inductor. en
dc.description.sponsorship Enterprise Ireland and Microelectronics Circuits Center Ireland (Project CC-2008-2403); Science Foundation Ireland (National Access Program: Project NAP412) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.relation.ispartof 2013 IEEE 63rd Electronic Components and Technology Conference
dc.relation.uri https://ieeexplore.ieee.org/document/6575844
dc.rights © 2013, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject CMOS integrated circuits en
dc.subject DC-DC power convertors en
dc.subject Inductors en
dc.subject Integrated circuit design en
dc.subject Power integrated circuits en
dc.subject System-in-package en
dc.subject DC-DC converter en
dc.subject Planar inductor en
dc.subject Power IC en
dc.subject Power converters en
dc.subject Form factor reduction en
dc.subject Cost reduction en
dc.subject Switched mode power supply en
dc.subject Power supply in package solution en
dc.subject PwrSiP en
dc.subject CMOS process en
dc.subject IC design en
dc.subject On-silicon integrated micro-inductors en
dc.subject Voltage 5 V en
dc.subject Frequency 40 MHz en
dc.subject Size 0.35 mum en
dc.subject Frequency 20 MHz en
dc.subject Integrated circuits en
dc.subject Wires en
dc.subject Magnetic cores en
dc.subject Shift registers en
dc.subject Resistance en
dc.subject Inductance en
dc.title High frequency DC-DC converter with co-packaged planar inductor and power IC en
dc.type Conference item en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-03-26T09:43:47Z
dc.description.version Accepted Version en
dc.internal.rssid 479190772
dc.internal.rssid 477476998
dc.contributor.funder Enterprise Ireland en
dc.contributor.funder Science Foundation Ireland en
dc.contributor.funder Microelectronics Circuits Center Ireland
dc.description.status Peer reviewed en
dc.internal.copyrightchecked Yes en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Las Vegas, NV, USA en
dc.internal.IRISemailaddress james.rohan@tyndall.ie en
dc.internal.IRISemailaddress cian.omathuna@ucc.ie en

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