High efficiency Si integrated micro-transformers using stacked copper windings for power conversion applications

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dc.contributor.author Wang, Ningning
dc.contributor.author Kulkarni, Santosh
dc.contributor.author Jamieson, Brice
dc.contributor.author Rohan, James F.
dc.contributor.author Casey, Declan P.
dc.contributor.author Roy, Saibal
dc.contributor.author Ó Mathúna, S. Cian
dc.date.accessioned 2019-03-26T11:45:41Z
dc.date.available 2019-03-26T11:45:41Z
dc.date.issued 2012-01
dc.identifier.citation Wang, N., Kulkarni, S., Jamieson, B., Rohan, J., Casey, D., Roy, S. and Ó Mathúna, C. (2012) 'High efficiency Si integrated micro-transformers using stacked copper windings for power conversion applications', 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Orlando, Florida, USA, 5-9 February, pp. 411-416. doi:10.1109/APEC.2012.6165852 en
dc.identifier.startpage 411 en
dc.identifier.endpage 416 en
dc.identifier.isbn 978-1-4577-1214-2
dc.identifier.isbn 978-1-4577-1215-9
dc.identifier.isbn 978-1-4577-1216-6
dc.identifier.issn 1048-2334
dc.identifier.uri http://hdl.handle.net/10468/7676
dc.identifier.doi 10.1109/APEC.2012.6165852
dc.description.abstract This paper details the design, fabrication, and characterization of silicon integrated micro-transformers. Two types of race-track shaped micro-transformers, single copper winding or single layer metal (SLM) and double copper winding or double layer metal (DLM) were designed and fabricated using standard CMOS processing. The DLM devices have higher inductance density than SLM devices realized within similar footprint area. The design study showed that the efficiency of micro-transformers increased from 37% for SLM designs to over 75% for DLM transformers at 20 MHz. en
dc.description.sponsorship Enterprise Ireland (Grant CFTD 2008/331) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.relation.ispartof 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC)
dc.relation.uri https://ieeexplore.ieee.org/document/6165852
dc.rights © 2012, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Thin-film microtransformer en
dc.subject Frequency en
dc.subject Converters en
dc.title High efficiency Si integrated micro-transformers using stacked copper windings for power conversion applications en
dc.type Conference item en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-03-26T11:38:53Z
dc.description.version Accepted Version en
dc.internal.rssid 348784373
dc.internal.rssid 259773587
dc.internal.wokid WOS:000309117700062
dc.contributor.funder Enterprise Ireland en
dc.description.status Peer reviewed en
dc.internal.copyrightchecked Yes en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Orlando, Florida, USA en
dc.internal.IRISemailaddress james.rohan@tyndall.ie en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie


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