LED flip-chip assembly with electroplated AuSn alloy

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dc.contributor.author Maaskant, Pleun P.
dc.contributor.author Akhter, Mahbub
dc.contributor.author Cordero, Nicolas
dc.contributor.author Casey, Declan P.
dc.contributor.author Rohan, James F.
dc.contributor.author Roycroft, Brendan J.
dc.contributor.author Corbett, Brian M.
dc.date.accessioned 2019-03-28T11:32:25Z
dc.date.available 2019-03-28T11:32:25Z
dc.date.issued 2005-04-11
dc.identifier.citation Maaskant, P. P., Akhter, M., Cordero, N., Casey, D. P., Rohan, J. F., Roycroft, B. J. and Corbett, B. M. (2005) 'LED flip-chip assembly with electroplated AuSn alloy', Physica Status Solidi (C), 2(7), pp. 2907-2911. doi:10.1002/pssc.200461566 en
dc.identifier.volume 2 en
dc.identifier.issued 7 en
dc.identifier.startpage 2907 en
dc.identifier.endpage 2911 en
dc.identifier.issn 1862-6351
dc.identifier.issn 1610-1642
dc.identifier.uri http://hdl.handle.net/10468/7686
dc.identifier.doi 10.1002/pssc.200461566
dc.description.abstract InGaN based high brightness (HB)‐LED chips have been fabricated and bonded to substrates that were coated with electroplated Au/Sn/Au solder. The assemblies yielded a forward voltage of 5.6 V and an optical output power of 42 mW when tested at 1,000 mA bias. The electroluminescence distribution was mapped with a CCD camera to determine the current spreading into the p‐contact region. Computational fluid dynamics (CFD) was used to check the effect of non‐uniform current spreading on the thermal resistance of the assemblies. We show that a good knowledge of the non‐uniform heat generation is required to obtain accurate modelling results. The bond strength of the AuSn solder joints exceeded the norm, when shear tested according to MIL‐STD‐883E (method 2019.5). en
dc.description.sponsorship Enterprise Ireland (Grant IF/2002/025) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher John Wiley & Sons, Inc. en
dc.relation.uri https://doi.org/10.1002/pssc.200461566
dc.rights © 2005, WILEY‐VCH Verlag GmbH & Co. This is the accepted manuscript version of the following article: Maaskant, P. P., Akhter, M., Cordero, N., Casey, D. P., Rohan, J. F., Roycroft, B. J. and Corbett, B. M. (2005) 'LED flip-chip assembly with electroplated AuSn alloy', Physica Status Solidi (C), 2(7), pp. 2907-2911. doi:10.1002/pssc.200461566, which has been published in final form at https://doi.org/10.1002/pssc.200461566. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving. en
dc.subject 78.66.Fd en
dc.subject 81.15.Pq en
dc.subject 85.30.De en
dc.subject 85.60.Jb en
dc.title LED flip-chip assembly with electroplated AuSn alloy en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother James Rohan, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: james.rohan@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-03-28T11:22:20Z
dc.description.version Accepted Version en
dc.internal.rssid 205924862
dc.contributor.funder Enterprise Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Physica Status Solidi (C) en
dc.internal.copyrightchecked Yes en
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress james.rohan@tyndall.ie en


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