Pluggable silicon photonic MEMS switch package for data centre

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dc.contributor.author Hwang, How Yuan
dc.contributor.author Lee, Jun Su
dc.contributor.author Henriksson, Johannes
dc.contributor.author Kwon, Kyungmok
dc.contributor.author Seok, Tae Joon
dc.contributor.author Wu, Ming C.
dc.contributor.author O'Brien, Peter A.
dc.date.accessioned 2019-04-12T11:24:04Z
dc.date.available 2019-04-12T11:24:04Z
dc.date.issued 2018-12
dc.identifier.citation Hwang, H. Y., Lee, J. S., Henriksson, J., Kwon, K., Seok, T. J., Wu, M. C. and O’Brien, P. (2018) 'Pluggable Silicon Photonic MEMS Switch Package for Data Centre, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), Singapore, 4-7 December, pp. 46-49. doi: 10.1109/EPTC.2018.8654270 en
dc.identifier.startpage 46 en
dc.identifier.endpage 49 en
dc.identifier.isbn 978-1-5386-7668-4
dc.identifier.isbn 978-1-5386-7667-7
dc.identifier.isbn 978-1-5386-7669-1
dc.identifier.uri http://hdl.handle.net/10468/7759
dc.identifier.doi 10.1109/EPTC.2018.8654270 en
dc.description.abstract Consumers' thirst for data has led to the development of various silicon photonic switching devices that are highly scalable while maintaining their relatively compact form factor at the same time. This demands a paradigm shift in the way these devices are being packaged, as optical and electrical ports are involved. In this article, we proposed a pluggable silicon photonic MEMS switch package with passive optical coupling assembly. This approach shifts fibre coupling away from the package, keeping it “purely electrical.” The pluggable concept is separately demonstrated through spring contacted hybrid assembly and pairs of vertically stack surface gratings. Insertion losses are comparable to planar fibre-to-grating coupling, with relatively broadband transmission and assembly tolerance. en
dc.description.sponsorship National Science Foundation (Center for Integrated Access Network (CIAN), United States); en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.relation.ispartof 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
dc.relation.uri https://ieeexplore.ieee.org/document/8654270
dc.rights © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Diffraction gratings en
dc.subject Elemental semiconductors en
dc.subject Integrated optics en
dc.subject Micro-optomechanical devices en
dc.subject Optical couplers en
dc.subject Optical fabrication en
dc.subject Optical losses en
dc.subject Optical switches en
dc.subject Photonic switching systems en
dc.subject Silicon en
dc.subject Pluggable silicon photonic MEMS switch package en
dc.subject Data centre en
dc.subject Silicon photonic switching devices en
dc.subject Optical ports en
dc.subject Electrical ports en
dc.subject Passive optical coupling assembly en
dc.subject Compact form factor en
dc.subject Paradigm shift en
dc.subject Spring contacted hybrid assembly en
dc.subject Vertically stack surface gratings en
dc.subject Broadband transmission en
dc.subject Insertion losses en
dc.subject Assembly tolerance en
dc.subject Optical fibers en
dc.subject Photonics en
dc.subject Optical coupling en
dc.subject Couplings en
dc.title Pluggable silicon photonic MEMS switch package for data centre en
dc.type Conference item en
dc.internal.authorcontactother How Yuan Hwang, Tyndall Photonics, University College Cork, Cork, Ireland. +353-21-490-3000 Email: howyuan.hwang@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-04-12T11:14:56Z
dc.description.version Accepted Version en
dc.internal.rssid 481271389
dc.contributor.funder National Science Foundation en
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) en
dc.internal.copyrightchecked No !!CORA!!
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Singapore en
dc.internal.IRISemailaddress howyuan.hwang@tyndall.ie en
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/ en


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