Data transmission at 1300 nm using optical interposer comprising hybrid integrated silicon waveguide and dilute nitride electroabsorption modulator

Sheehan, Robert N.; Guina, Mircea; Viheriälä, Jukka; Isoaho, Riku; Harjanne, Mikko; Azarello, Francesco; Yang, Mingqi; Malacarne, Antonio; Aalto, Timo; Peters, Frank H.

doi:10.1364/OE.26.034336

UCC | UCC Library | IRIS

CORA Home

→
College of Science, Engineering and Food Science
→
Physics
→
Physics - Journal Articles
→
View Item

Show simple item record

dc.contributor.author	Sheehan, Robert N.
dc.contributor.author	Guina, Mircea
dc.contributor.author	Viheriälä, Jukka
dc.contributor.author	Isoaho, Riku
dc.contributor.author	Harjanne, Mikko
dc.contributor.author	Azarello, Francesco
dc.contributor.author	Yang, Mingqi
dc.contributor.author	Malacarne, Antonio
dc.contributor.author	Aalto, Timo
dc.contributor.author	Peters, Frank H.
dc.date.accessioned	2019-05-20T15:54:16Z
dc.date.available	2019-05-20T15:54:16Z
dc.date.issued	2018-12-24
dc.identifier.citation	Sheehan, R.N., Guina, M., Viheriälä, J., Isoaho, R., Harjanne, M., Azarello, F., Yang, M., Malacarne, A., Aalto, T. and Peters, F.H., 2018. Data transmission at 1300 nm using optical interposer comprising hybrid integrated silicon waveguide and dilute nitride electroabsorption modulator. Optics express, 26, 34336-34345. DOI: 10.1364/OE.26.034336	en
dc.identifier.volume	26	en
dc.identifier.issued	26	en
dc.identifier.startpage	34336	en
dc.identifier.endpage	34345	en
dc.identifier.uri	http://hdl.handle.net/10468/7943
dc.identifier.doi	10.1364/OE.26.034336	en
dc.description.abstract	High speed back-to-back transmission of NRZ data at 12.5 Gbit/s was achieved over a repeaterless optical network without the use of forward error correction or optical clock recovery using a hybrid integrated silicon photonics optical interconnect. The interconnect comprises an electroabsorption modulator based on dilute nitride multiple quantum well material on GaAs substrate optically coupled to large core silicon waveguide using passive alignment and flip-chip bonding.	en
dc.format.mimetype	application/pdf	en
dc.language.iso	en	en
dc.publisher	Optical Society of America OSA	en
dc.relation.uri	https://www.osapublishing.org/oe/abstract.cfm?uri=oe-26-26-34336
dc.rights	© 2018 Optical Society of America under the terms of the OSA Open Access Publishing Agreement. Users may use, reuse, and build upon the article, or use the article for text or data mining, so long as such uses are for non-commercial purposes and appropriate attribution is maintained. All other rights are reserved.	en
dc.rights.uri	https://www.osapublishing.org/library/license_v1.cfm#VOR-OA	en
dc.subject	Diode lasers	en
dc.subject	Optical amplification	en
dc.subject	Physical vapor deposition	en
dc.subject	Quantum well materials	en
dc.subject	Silica	en
dc.subject	Single mode fibers	en
dc.title	Data transmission at 1300 nm using optical interposer comprising hybrid integrated silicon waveguide and dilute nitride electroabsorption modulator	en
dc.type	Article (peer-reviewed)	en
dc.internal.authorcontactother	Robert Sheehan,Tyndall National Institute, University College Cork, Cork, Ireland. +353-21-490-3000 Email: robert.sheehan@tyndall.ie	en
dc.internal.availability	Full text available	en
dc.description.version	Published Version	en
dc.contributor.funder	FP7 Information and Communication Technologies	en
dc.description.status	Peer reviewed	en
dc.identifier.journaltitle	Optics Express	en
dc.internal.IRISemailaddress	robert.sheehan@tyndall.ie	en
dc.relation.project	info:eu-repo/grantAgreement/EC/FP7::SP1::ICT/619806/EU/Revolutionary Advances in Photonics Integration Being Applied for Optical Communication/RAPIDO	en
dc.identifier.eissn	1094-4087