High-Q three-dimensional microfabricated magnetic-core toroidal inductors for power supplies in package

Show simple item record

dc.contributor.author Le, Hoa Thanh
dc.contributor.author Nour, Yasser
dc.contributor.author Pavlovic, Zoran
dc.contributor.author Ó Mathúna, S. Cian
dc.contributor.author Knott, Arnold
dc.contributor.author Jensen, Flemming
dc.contributor.author Han, Anpan
dc.contributor.author Kulkarni, Santosh
dc.contributor.author Ouyang, Ziwei
dc.date.accessioned 2019-05-21T15:53:00Z
dc.date.available 2019-05-21T15:53:00Z
dc.date.issued 2018-06-14
dc.identifier.citation Le, H. T., Nour, Y., Pavlovic, Z., Mathúna, C. O., Knott, A., Jensen, F., Han, A., Kulkarni, S. and Ouyang, Z. (2019) 'High-QThree-Dimensional Microfabricated Magnetic-Core Toroidal Inductors for Power Supplies in Package', IEEE Transactions on Power Electronics, 34(1), pp. 74-85. doi: 10.1109/TPEL.2018.2847439 en
dc.identifier.volume 34 en
dc.identifier.issued 1 en
dc.identifier.startpage 74 en
dc.identifier.endpage 85 en
dc.identifier.issn 0885-8993
dc.identifier.uri http://hdl.handle.net/10468/7956
dc.identifier.doi 10.1109/TPEL.2018.2847439 en
dc.description.abstract The integration of power inductors is a roadblock in realizing highly miniaturized power supply in package (PSiP) and power supply on chip. Inductors in such power systems are used for energy storage and filtering, but they dominate in size and loss. This paper presents a novel three-dimensional in-silicon through-silicon via (TSV) magnetic-core toroidal inductor for PSiP. The magnetic powder based core is embedded into a TSV air-core inductor using a casting method. The unique air-core inductor design with a hollow core and suspended windings enables a complete core filling with microscale magnetic powders. The proposed casting method is simple, scalable, and generic for a wide range of magnetic powders. TSV magnetic-core inductors are fabricated in a compact size of 2.4 mm × 2.4 mm × 0.28 mm with the core content varying from 63 to 88 wt% of soft ferrite NiZn powders. The TSV magnetic-core toroidal inductors are fabricated and electrically characterized. Small-signal measurements show a threefold higher inductance of 112 nH and a 30% higher quality factor of 14.3 at 12.5 MHz for magnetic-core inductors compared with similar TSV air-core inductors. The small-signal measurement results are verified by the modeled results. The total core loss is characterized by large-signal measurements. A suitable inductor is implemented in a 12-MHz buck converter that operates in a zero-voltage-switching mode. The converter achieves a peak efficiency of 71.6% and an output power of 2.4 W while converting 12 to 5 V dc . en
dc.description.sponsorship Enterprise Ireland (TinyPower project, funded by the Innovation Fund under Grant 67-2014-1) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.relation.uri https://ieeexplore.ieee.org/document/8385217
dc.rights © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Inductor en
dc.subject Magnetic materials en
dc.subject Microfabrication en
dc.subject Power supply in package (PSiP) en
dc.subject Through-silicon via (TSV) en
dc.subject Inductors en
dc.subject Magnetic cores en
dc.subject Through-silicon vias en
dc.subject Toroidal magnetic fields en
dc.subject Powders Soft magnetic materials en
dc.subject Soft magnetic materials en
dc.subject Windings en
dc.title High-Q three-dimensional microfabricated magnetic-core toroidal inductors for power supplies in package en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Cian O Mathuna, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: cian.omathuna@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-05-09T13:45:31Z
dc.description.version Accepted Version en
dc.internal.rssid 477477088
dc.contributor.funder Science Foundation Ireland en
dc.contributor.funder Enterprise Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle IEEE Transactions on Power Electronics en
dc.internal.copyrightchecked Yes
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Starting Investigator Research Grant (SIRG)/15/SIRG/3569/IE/Advanced Power Magnetics Programme for High Efficiency Power Supplies/ en
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Investigator Programme/15/IA/3180/IE/Advanced Integrated Power Magnetics Technology- From Atoms to Systems/ en
dc.identifier.eissn 1941-0107


Files in this item

This item appears in the following Collection(s)

Show simple item record

This website uses cookies. By using this website, you consent to the use of cookies in accordance with the UCC Privacy and Cookies Statement. For more information about cookies and how you can disable them, visit our Privacy and Cookies statement