dc.contributor.author |
Cussen, Teresa |
|
dc.contributor.author |
Majeed, Bivragh |
|
dc.contributor.author |
Delaney, Kieran |
|
dc.contributor.author |
Ó Mathúna, S. Cian |
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dc.date.accessioned |
2019-05-27T14:14:12Z |
|
dc.date.available |
2019-05-27T14:14:12Z |
|
dc.date.issued |
2002-09 |
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dc.identifier.citation |
Cussen, T., Majeed, B., Delaney, K. and Ó Mathuna, S. Cian (2002) 'Thin Silicon in a Novel 3-D Format for Implementation in Distributed Autonomous Micro Modules', UbiComp 2002: Fourth International Conference on Ubiquitous Computing, Goteberg, Sweden, 29 September - 1 October, pp. 49-50. |
en |
dc.identifier.startpage |
49 |
en |
dc.identifier.endpage |
50 |
en |
dc.identifier.uri |
http://hdl.handle.net/10468/7983 |
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dc.description.abstract |
Silicon thinning, interconnection and packaging are key innovative hardware technologies that can be used to realise distributed autonomous micro-modules (DAMM) for future ad-hoc networks in ambient systems and intelligent environments. These would interact, respond and learn from their surroundings making integration of engineering, computer science and human intelligence a reality. This paper investigates thinning silicon sensors and packaging these sensors in a tetrahedral format. This form was chosen because it is vastly expandable and when miniaturised can be used as a building block for DAMM’s, which can be designed to physically integrate into materials from which artefacts are fabricated. |
en |
dc.format.mimetype |
application/pdf |
en |
dc.language.iso |
en |
en |
dc.publisher |
Viktoria Institute, Göteborg, Sweden |
en |
dc.relation.ispartof |
UbiComp 2002: Fourth International Conference on Ubiquitous Computing |
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dc.relation.uri |
http://www.ubicomp.org/ubicomp2002/ubicomp_adjunct_proceedings.pdf |
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dc.rights |
© 2002 The Authors. |
en |
dc.subject |
Thin silicon |
en |
dc.subject |
3-D packaging |
en |
dc.subject |
Flip chip |
en |
dc.subject |
Micro-modules |
en |
dc.title |
Thin silicon in a novel 3-D format for implementation in distributed autonomous micro modules |
en |
dc.type |
Conference item |
en |
dc.internal.authorcontactother |
Cian O Mathuna, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: cian.omathuna@tyndall.ie |
en |
dc.internal.availability |
Full text available |
en |
dc.date.updated |
2019-05-27T14:07:48Z |
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dc.description.version |
Published Version |
en |
dc.internal.rssid |
303480517 |
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dc.description.status |
Peer reviewed |
en |
dc.internal.copyrightchecked |
No !!CORA!! |
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dc.internal.licenseacceptance |
Yes |
en |
dc.internal.conferencelocation |
Goteberg, Sweden |
en |
dc.internal.IRISemailaddress |
cian.omathuna@tyndall.ie |
en |