Thin silicon in a novel 3-D format for implementation in distributed autonomous micro modules

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dc.contributor.author Cussen, Teresa
dc.contributor.author Majeed, Bivragh
dc.contributor.author Delaney, Kieran
dc.contributor.author Ó Mathúna, S. Cian
dc.date.accessioned 2019-05-27T14:14:12Z
dc.date.available 2019-05-27T14:14:12Z
dc.date.issued 2002-09
dc.identifier.citation Cussen, T., Majeed, B., Delaney, K. and Ó Mathuna, S. Cian (2002) 'Thin Silicon in a Novel 3-D Format for Implementation in Distributed Autonomous Micro Modules', UbiComp 2002: Fourth International Conference on Ubiquitous Computing, Goteberg, Sweden, 29 September - 1 October, pp. 49-50. en
dc.identifier.startpage 49 en
dc.identifier.endpage 50 en
dc.identifier.uri http://hdl.handle.net/10468/7983
dc.description.abstract Silicon thinning, interconnection and packaging are key innovative hardware technologies that can be used to realise distributed autonomous micro-modules (DAMM) for future ad-hoc networks in ambient systems and intelligent environments. These would interact, respond and learn from their surroundings making integration of engineering, computer science and human intelligence a reality. This paper investigates thinning silicon sensors and packaging these sensors in a tetrahedral format. This form was chosen because it is vastly expandable and when miniaturised can be used as a building block for DAMM’s, which can be designed to physically integrate into materials from which artefacts are fabricated. en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Viktoria Institute, Göteborg, Sweden en
dc.relation.ispartof UbiComp 2002: Fourth International Conference on Ubiquitous Computing
dc.relation.uri http://www.ubicomp.org/ubicomp2002/ubicomp_adjunct_proceedings.pdf
dc.rights © 2002 The Authors. en
dc.subject Thin silicon en
dc.subject 3-D packaging en
dc.subject Flip chip en
dc.subject Micro-modules en
dc.title Thin silicon in a novel 3-D format for implementation in distributed autonomous micro modules en
dc.type Conference item en
dc.internal.authorcontactother Cian O Mathuna, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: cian.omathuna@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-05-27T14:07:48Z
dc.description.version Published Version en
dc.internal.rssid 303480517
dc.description.status Peer reviewed en
dc.internal.copyrightchecked No !!CORA!!
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Goteberg, Sweden en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en


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