Miniaturised modular wireless sensor networks

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dc.contributor.author Barton, John
dc.contributor.author Delaney, Kieran
dc.contributor.author Ó Mathúna, S. Cian
dc.contributor.author Paradiso, Joseph A
dc.date.accessioned 2019-05-27T14:31:09Z
dc.date.available 2019-05-27T14:31:09Z
dc.date.issued 2002-09
dc.identifier.citation Barton, J., Delaney, K., Ó Mathuna, S. Cian and Paradiso, J. A. (2002) 'Miniaturised Modular Wireless Sensor Networks', UbiComp 2002: Fourth International Conference on Ubiquitous Computing, Göteborg, Sweden, 29 September - 01 October, pp. 25-26 en
dc.identifier.startpage 25 en
dc.identifier.endpage 26 en
dc.identifier.uri http://hdl.handle.net/10468/7984
dc.description.abstract This paper focuses on the development of miniaturised modular wireless sensor networks that can be used to realise distributed autonomous sensors for future ad-hoc networks in the ambient systems and intelligent environments arena. Such modular, mobile networks are key enabling technologies in the field of ubiquitous computing. The modules are fabricated in a 3-D stackable form with a novel modular PCB design which can be mounted on artefacts or on parts of the body, can measure acceleration, rotation, shock, elevation etc. and have a low-power RF channel-shared link to a base station (for sports, exercise, entertainment, health). The modular nature of the design allows for extra panels to be developed and added easily. en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Viktoria Institute, Göteborg, Sweden en
dc.relation.ispartof UbiComp 2002: Fourth International Conference on Ubiquitous Computing
dc.relation.uri http://www.ubicomp.org/ubicomp2002/ubicomp_adjunct_proceedings.pdf
dc.rights © 2002 The Authors. en
dc.subject Modularity en
dc.subject Wireless sensor networks en
dc.subject 3-D packaging en
dc.title Miniaturised modular wireless sensor networks en
dc.type Conference item en
dc.internal.authorcontactother Cian O Mathuna, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: cian.omathuna@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2019-05-27T14:25:57Z
dc.description.version Published Version en
dc.internal.rssid 477476848
dc.contributor.funder Higher Education Authority en
dc.description.status Peer reviewed en
dc.internal.copyrightchecked No !!CORA!!
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Goteberg, Sweden en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en


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