Edge-coupling of O-Band InP etched-facet lasers to polymer waveguides on SOI by micro-transfer-printing

Show simple item record

dc.contributor.author Loi, Ruggero
dc.contributor.author Iadanza, Simone
dc.contributor.author Roycroft, Brendan
dc.contributor.author O'Callaghan, James
dc.contributor.author Liu, Lei
dc.contributor.author Thomas, Kevin
dc.contributor.author Gocalińska, Agnieszka M.
dc.contributor.author Pelucchi, Emanuele
dc.contributor.author Farrell, Alexander
dc.contributor.author Kelleher, Steven
dc.contributor.author Gul, Raja Fazan
dc.contributor.author Trindade, António José
dc.contributor.author Gomez, David
dc.contributor.author O'Faolain, Liam
dc.contributor.author Corbett, Brian
dc.date.accessioned 2020-01-06T15:09:06Z
dc.date.available 2020-01-06T15:09:06Z
dc.date.issued 2019-12-09
dc.identifier.citation Loi, R., Iadanza, S., Roycroft, B., O’Callaghan, J., Liu, L., Thomas, K., Gocalinska, A., Pelucchi, E., Farrell, A., Kelleher, S., Gul, R. F., Trindade, A. J., Gomez, D., O’Faolain, L. and Corbett, B. (2020) 'Edge-Coupling of O-Band InP Etched-Facet Lasers to Polymer Waveguides on SOI by Micro-Transfer-Printing', IEEE Journal of Quantum Electronics, 56(1), pp. 1-8. doi: 10.1109/JQE.2019.2958365 en
dc.identifier.volume 56 en
dc.identifier.issued 1 en
dc.identifier.startpage 1 en
dc.identifier.endpage 8 en
dc.identifier.issn 1558-1713
dc.identifier.uri http://hdl.handle.net/10468/9453
dc.identifier.doi 10.1109/JQE.2019.2958365 en
dc.description.abstract O-band InP etched facets lasers were heterogeneously integrated by micro-transfer-printing into a 1.54 µm deep recess created in the 3 µm thick oxide layer of a 220 nm SOI wafer. A 7 × 1.5 µm2 cross-section, 2 mm long multimode polymer waveguide was aligned to the ridge post-integration by e-beam lithography with <0.7 µm lateral misalignment and incorporated a tapered silicon waveguide. A 170 nm thick metal layer positioned at the bottom of the recess adjusts the vertical alignment of the laser and serves as a thermal via to sink the heat to the Si substrate. This strategy shows a roadmap for active polymer waveguide-based photonic integrated circuits. en
dc.description.sponsorship Science Foundation Ireland (15/IA/2864) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.relation.uri https://ieeexplore.ieee.org/document/8928514
dc.rights © 2020 the authors. Published by IEEE. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see http://creativecommons.org/licenses/by/4.0/ en
dc.rights.uri http://creativecommons.org/licenses/by/4.0/ en
dc.subject Waveguide lasers en
dc.subject Optical waveguides en
dc.subject Polymers en
dc.subject Silicon en
dc.subject Laser modes en
dc.subject Substrates en
dc.subject Metals en
dc.subject Heterogeneous integration en
dc.subject III-V semiconductors laser en
dc.subject silicon photonics en
dc.subject polymer waveguides en
dc.title Edge-coupling of O-Band InP etched-facet lasers to polymer waveguides on SOI by micro-transfer-printing en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Brendan Roycroft, Tyndall Photonics, University College Cork, Cork, Ireland. +353-21-490-3000 Email: b.roycroft@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2020-01-06T14:59:45Z
dc.description.version Published Version en
dc.internal.rssid 500172592
dc.contributor.funder Science Foundation Ireland en
dc.contributor.funder Horizon 2020 en
dc.contributor.funder European Research Council en
dc.description.status Peer reviewed en
dc.identifier.journaltitle IEEE Journal of Quantum Electronics en
dc.internal.copyrightchecked Yes
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress b.roycroft@tyndall.ie en
dc.internal.IRISemailaddress rloi@x-celeprint.com
dc.internal.bibliocheck Check funding info Science Foundation Ireland (15/IA/2864): add to relation.project en
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/ en
dc.relation.project info:eu-repo/grantAgreement/EC/H2020::RIA/645314/EU/Transfer-print operations for heterogeneous integration/TOP HIT en
dc.relation.project info:eu-repo/grantAgreement/EC/FP7::SP2::ERC/337508/EU/DAtacommunications based on NanophotoniC Resonators/DANCER en


Files in this item

This item appears in the following Collection(s)

Show simple item record

© 2020 the authors. Published by IEEE. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see http://creativecommons.org/licenses/by/4.0/ Except where otherwise noted, this item's license is described as © 2020 the authors. Published by IEEE. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see http://creativecommons.org/licenses/by/4.0/
This website uses cookies. By using this website, you consent to the use of cookies in accordance with the UCC Privacy and Cookies Statement. For more information about cookies and how you can disable them, visit our Privacy and Cookies statement