Micro-transfer-printing for heterogeneous integration

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Micro-transfer-printing for heterogeneous integration

Corbett, Brian; Li, Zhi; Buehler, K.; Naumann, F.; Krieger, U.; Wicht, S.; Bower, C. A.
Date: 2019-06-13
Copyright: © 2019, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Related: https://ieeexplore.ieee.org/document/8735381
http://www.jsps191.org/ltb3d-2019/
Citation: Corbett, B., Li, Z., Buehler, K., Naumann, F., Krieger, U., Wicht, S. and Bower, C. A. (2019) 'Micro-transfer-printing for heterogeneous integration', 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Kanazawa, Japan, 21-25 May, p.34. doi: 10.23919/LTB-3D.2019.8735381
Published Version: 10.23919/LTB-3D.2019.8735381

Abstract:

Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different materials and devices. The technique is particularly applicable to photonics where a typical system requires diverse arrays of components.

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