Micro-transfer-printing for heterogeneous integration

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Date
2019-06-13
Authors
Corbett, Brian
Li, Zhi
Buehler, K.
Naumann, F.
Krieger, U.
Wicht, S.
Bower, C. A.
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Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
10.23919/LTB-3D.2019.8735381
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Abstract
Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different materials and devices. The technique is particularly applicable to photonics where a typical system requires diverse arrays of components.
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Keywords
Integrated optics , Microassembling , Printing , Microtransfer-printing , Heterogeneous integration , Photonics , Silicon , Substrates , Surface treatment , Dielectrics , Polymers , III-V semiconductor materials
Citation
Corbett, B., Li, Z., Buehler, K., Naumann, F., Krieger, U., Wicht, S. and Bower, C. A. (2019) 'Micro-transfer-printing for heterogeneous integration', 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Kanazawa, Japan, 21-25 May, p.34. doi: 10.23919/LTB-3D.2019.8735381
Link to publisher’s version
https://ieeexplore.ieee.org/document/8735381
 http://www.jsps191.org/ltb3d-2019/
URI
https://hdl.handle.net/10468/9636
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Tyndall National Institute - Conference Items
Copyright
© 2019, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.