Multi-micron silicon photonicsplatform for highly manufacturable and versatile photonic integrated circuits

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dc.contributor.author Zilkie, A. J.
dc.contributor.author Srinivasan, P.
dc.contributor.author Trita, A.
dc.contributor.author Schrans, T.
dc.contributor.author Yu, G.
dc.contributor.author Byrd, J.
dc.contributor.author Nelson, D. A.
dc.contributor.author Muth, K.
dc.contributor.author Lerose, D.
dc.contributor.author Alalusi, M.
dc.contributor.author Masuda, K.
dc.contributor.author Ziebell, M.
dc.contributor.author Abediasl, H.
dc.contributor.author Drake, J.
dc.contributor.author Miller, G.
dc.contributor.author Nykanen, H.
dc.contributor.author Kho, E.
dc.contributor.author Liu, Y.
dc.contributor.author Liang, H.
dc.contributor.author Yang, H.
dc.contributor.author Peters, Frank H.
dc.contributor.author Nagra, A. S.
dc.contributor.author Rickman, A. G.
dc.date.accessioned 2020-03-11T16:37:44Z
dc.date.available 2020-03-11T16:37:44Z
dc.date.issued 2019-04-15
dc.identifier.citation Zilkie, A. J., Srinivasan, P., Trita, A., Schrans, T., Yu, G., Byrd, J., Nelson, D. A., Muth, K., Lerose, D., Alalusi, M., Masuda, K., Ziebell, M., Abediasl, H., Drake, J., Miller, G., Nykanen, H., Kho, E., Liu, Y., Liang, H., Yang, H., Peters, F. H., Nagra, A. S. and Rickman, A. G. (2019) 'Multi-Micron Silicon Photonics Platform for Highly Manufacturable and Versatile Photonic Integrated Circuits', IEEE Journal of Selected Topics in Quantum Electronics, 25(5), pp. 1-13. doi: 10.1109/JSTQE.2019.2911432 en
dc.identifier.volume 25 en
dc.identifier.issued 5 en
dc.identifier.startpage 1 en
dc.identifier.endpage 13 en
dc.identifier.issn 1558-4542
dc.identifier.uri http://hdl.handle.net/10468/9757
dc.identifier.doi 10.1109/JSTQE.2019.2911432 en
dc.description.abstract We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturability, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-loss filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors. en
dc.description.sponsorship Business Finland and Tekes (under projects DEEPSIMOD, grant 5910/31/2017, project RAPSI, grant 55388, and project OPEC, grant 2814/31/2015) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.relation.uri https://ieeexplore.ieee.org/document/8691800
dc.rights © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Electroabsorption en
dc.subject Electro-optical modulation en
dc.subject Elemental semiconductors en
dc.subject Fibre optic sensors en
dc.subject Integrated optoelectronics en
dc.subject Optical fibre communication en
dc.subject Optical fibre filters en
dc.subject Optical fibre losses en
dc.subject Photodetectors en
dc.subject Semiconductor optical amplifiers en
dc.subject Silicon en
dc.subject Wavelength division multiplexing en
dc.subject Data communications en
dc.subject Power efficiency en
dc.subject Low-loss fiber attach en
dc.subject Compact low-loss filters en
dc.subject Efficient hybrid wavelength division multiplexed lasers en
dc.subject High-speed electro-absorption modulators en
dc.subject Integrated photodetectors en
dc.subject Sensing applications en
dc.subject High-volume manufacturing en
dc.subject Integrated photonic applications en
dc.subject Multimicron silicon photonics platform en
dc.subject Versatile photonic integrated circuits en
dc.subject Highly manufacturable integrated circuits en
dc.subject Si en
dc.subject Photonics en
dc.subject Micrometers en
dc.subject Optical fiber polarization en
dc.subject Optical losses en
dc.subject Ribs en
dc.subject Photonic integrated circuits en
dc.subject integrated optics en
dc.subject Silicon photonics en
dc.subject Photonic integration en
dc.subject Optical interconnects en
dc.subject Optoelectronics en
dc.subject Hybrid lasers en
dc.subject III-V hybrid integration en
dc.title Multi-micron silicon photonicsplatform for highly manufacturable and versatile photonic integrated circuits en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Frank Peters, Physics, University College Cork, Cork, Ireland. +353-21-490-3000 Email: f.peters@ucc.ie en
dc.internal.availability Full text available en
dc.date.updated 2020-03-11T16:30:26Z
dc.description.version Accepted Version en
dc.internal.rssid 505828072
dc.contributor.funder Tekes en
dc.contributor.funder Business Finland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle IEEE Journal of Selected Topics In Quantum Electronics en
dc.internal.copyrightchecked Yes
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress f.peters@ucc.ie en
dc.identifier.articleid 8200713 en


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