Zincate-free, electroless nickel deposition on aluminum bond pads

dc.contributor.authorRohan, James F.
dc.contributor.authorMurphy, Patricia A.
dc.contributor.authorBarrett, John
dc.contributor.funderEnterprise Irelanden
dc.date.accessioned2014-02-04T15:58:05Z
dc.date.available2014-02-04T15:58:05Z
dc.date.issued2005-01
dc.date.updated2013-12-18T16:27:11Z
dc.description.abstractA zincate-free electroless nickel deposition on aluminum bond pads is investigated. A three-step, etch, rinse, and electroless plating, is demonstrated for deposition on aluminum bond pads patterned with polyimide. The chemicals used are compatible with this dielectric material. The deposition has been achieved with good selectivity, uniformity, and deposition rate at 40 × 40   μ m aluminum bond pads. The adhesion and contact resistance were also determined and improved through anneals in the range 200-400°C for 1 h. The optimized condition for adhesion and contact resistance was an anneal at 400°C. The combination of a nickel hypophosphite reducing agent and the additives used leads to an active plating bath in the early stages of deposition, by comparison with commercial solutions, and hence, good coverage of the aluminum bond pad using the simplified process.en
dc.description.sponsorshipEnterprise Ireland (HE/98/262)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationROHAN, J. F., MURPHY, P. A. & BARRETT, J. 2005. Zincate-Free, Electroless Nickel Deposition on Aluminum Bond Pads. Journal of The Electrochemical Society, 152, C32-C35. doi: 10.1149/1.1836131en
dc.identifier.doi10.1149/1.1836131
dc.identifier.endpageC35en
dc.identifier.issn0013-4651
dc.identifier.issued1en
dc.identifier.journaltitleJournal of The Electrochemical Societyen
dc.identifier.startpageC32en
dc.identifier.urihttps://hdl.handle.net/10468/1363
dc.identifier.volume152en
dc.language.isoenen
dc.publisherThe Electrochemical Societyen
dc.relation.urihttp://jes.ecsdl.org/content/152/1/C32.abstract
dc.rights© The Electrochemical Society, Inc. 2005. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in ROHAN, J. F., MURPHY, P. A. & BARRETT, J. 2005. Zincate-Free, Electroless Nickel Deposition on Aluminum Bond Pads. Journal of The Electrochemical Society, 152, C32-C35. doi: 10.1149/1.1836131en
dc.subjectAluminiumen
dc.subjectNickelen
dc.subjectElectroless depositionen
dc.subjectIntegrated circuit interconnectionsen
dc.subjectContact resistanceen
dc.subjectAnnealingen
dc.subjectAdditivesen
dc.subjectAdhesionen
dc.titleZincate-free, electroless nickel deposition on aluminum bond padsen
dc.typeArticle (peer-reviewed)en
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