Sodium silicate as an enabler for wafer bonding of glass substrates and lids

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dc.contributor.authorGupta, Parnikaen
dc.contributor.authorO’Brien, Josephen
dc.contributor.authorLee, Jun Suen
dc.contributor.authorHwang, How Yuanen
dc.contributor.authorGradkowski, Kamilen
dc.contributor.authorMorrissey, Padraic E.en
dc.contributor.authorO’Brien, Peteren
dc.date.accessioned2024-07-29T13:51:57Z
dc.date.available2024-07-29T13:51:57Z
dc.date.issued2024-06en
dc.description.abstractThe outgassing challenge associated with using polymer-based die-attach adhesives for vacuum seal photonic packages is addressed in this extended abstract. In addition to this, die movement can occur after high temperature anodic bonding of the lid/cap wafer and substrate wafer due to low glass transition temperature of polymer based adhesive systems. This presents a challenge for photonic packages where photonic chip’s positional accuracy is critical. Silicate based adhesives are presented as a solution to enable vacuum seal packaging of photonic chips.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationGupta, P., O’Brien, J., Lee, J. S., Hwang, H. Y., Gradkowski, K., Morrissey, P. E. and O’Brien, P. (2024) 'Sodium silicate as an enabler for wafer bonding of glass substrates and lids', NordPac 2024, Tampere, Finland, June 11-13.en
dc.identifier.urihttps://hdl.handle.net/10468/16157
dc.language.isoenen
dc.rights© 2024, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectSodium silicateen
dc.subjectLid waferen
dc.subjectWafer bondingen
dc.subjectCuringen
dc.subjectPhotonic packageen
dc.titleSodium silicate as an enabler for wafer bonding of glass substrates and lidsen
dc.typeArticle (peer-reviewed)en
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